2024 IEEE International Interconnect Technology Conference (IITC)

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ISBN

979-8-3503-8517-5

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		Preview	Author(s)	Title	Type	Issue Date
	1		Saleh, A. S. ; Croes, K. ; Ceric, Hajdin ; De Wolf, I. ; Zahedmanesh, H.	Technology benchmarking of copper electromigration using a grain-sensitive simulation framework	Inproceedings Konferenzbeitrag	2024