2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

Book title Buchtitel
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
 
Publisher Herausgeber
IEEE Xplore
 

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Siroky, Georg ; Melinc, David ; Magnien, Julien ; Kozeschnik, Ernst ; Kieslinger, Dietmar ; Kraker, Elke ; Ecker, Werner Healing solders: A numerical investigation of damage-healing experimentsKonferenzbeitrag Inproceedings2020
2Hoffmann, Paul ; Nelhiebel, Michael ; Karunamurthy, Balamurugan ; Pettermann, Heinz E. ; Todt, Melanie Simulation of Fatigue Damage in Clusters of DMOS Cells Subjected to Non-Uniform Transient Thermo-Mechnical LoadingKonferenzbeitrag Inproceedings2020