2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
 
Publisher Herausgeber
IEEE Xplore
 

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Author:  Hoffmann, Paul

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1Hoffmann, Paul ; Nelhiebel, Michael ; Karunamurthy, Balamurugan ; Pettermann, Heinz E. ; Todt, Melanie Simulation of Fatigue Damage in Clusters of DMOS Cells Subjected to Non-Uniform Transient Thermo-Mechnical LoadingKonferenzbeitrag Inproceedings2020