2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)

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2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
 
Publisher Herausgeber
IEEE Xplore
 

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Author:  Kieslinger, Dietmar

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PreviewAuthor(s)TitleTypeIssue Date
1Siroky, Georg ; Melinc, David ; Magnien, Julien ; Kozeschnik, Ernst ; Kieslinger, Dietmar ; Kraker, Elke ; Ecker, Werner Healing solders: A numerical investigation of damage-healing experimentsKonferenzbeitrag Inproceedings2020