Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit

Organization Name (de) Name der Organisation (de)
E164-03-2 - Forschungsgruppe Mechanische Eigenschaften und Zuverlässigkeit
 
Code Kennzahl
E164-03-2
 
Type of Organization Organisationstyp
Research Group
 
Parent OrgUnit Übergeordnete Organisation
Active Aktiv
 


Results 1-20 of 50 (Search time: 0.002 seconds).

PreviewAuthors / EditorsTitleTypeIssue Date
1Czerny, Bernhard Wirebond reliability and accelerated mechanical testingPräsentation Presentation2019
2Czerny, Bernhard Wirebond reliability and accelerated mechanical testingPräsentation Presentation2019
3Czerny, Bernhard Wire bond reliability and accelerated mechanical testingPräsentation Presentation2019
4Gasser, Christoph ; Czerny, Bernhard ; Khatibi, Golta Versatile ultrasonic fatigue testing method with variable load ratio for small scaled samplesKonferenzbeitrag Inproceedings2019
5Khatibi, Golta ; Czerny, Bernhard ; Magnien, Julien ; Lederer, Martin ; Suhir, Ephraim ; Nicolics, Johann Towards Adequate Qualification Testing of Electronic Products: Review and ExtensionKonferenzbeitrag Inproceedings2014
6Liedtke, Magnus ; Khatibi, Golta ; Czerny, Bernhard ; Nicolics, Johann Thermomechanical Reliability Investigation of Insulated Gate Bipolar Transistor ModuleKonferenzbeitrag Inproceedings 2018
7Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann Temperature Dependent Relaxation Behavior of Pressureless and Pressure Assisted Sintered SilverKonferenzbeitrag Inproceedings2021
8Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann Temperature Dependent Relaxation Behavior of Ag-Sintered Copper JointsKonferenzbeitrag Inproceedings2021
9Gökdeniz, Z.G. ; Khatibi, Golta ; Gierl-Mayer, Christian ; Steiger-Thirsfeld, Andreas ; Mündlein, Martin Temperature Dependent Physical Properties of Sintered Silver Layers for Power ElectronicsKonferenzbeitrag Inproceedings2020
10Gökdeniz, Z.G. ; Khatibi, Golta ; Walter, Thomas ; Nicolics, Johann Temperature Dependent Mechanical Properties of Sintered Silver-Copper JointsKonferenzbeitrag Inproceedings 2018
11Lederer, M. ; Czerny, B. ; Nagl, B. ; Trnka, A. ; Khatibi, G. ; Thoben, M. Simulation of stress concentrations in wire-bonds using a novel strain gradient theoryKonferenzbeitrag Inproceedings2013
12Suhir, E. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor Film Grown on a Circular Substrate: Predictive Modeling of Lattice-Misfit StressesKonferenzbeitrag Inproceedings2016
13Lederer, M. ; Lassnig, A. ; Khatibi, G. ; Delshadmanesh, M. Reliability assessment of copper ball bonds by combination of simulation and accelerated mechanical testingKonferenzbeitrag Inproceedings2015
14Khatibi, Golta Reliability and lifetime assessment in power electronicsPräsentation Presentation2021
15Czerny, Bernhard ; Mazloum Nejadari, Ali ; Khatibi, Golta Reliability Analysis of fine and thick wire bondsPräsentation Presentation2016
16Mazloum Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Czerny, Bernhard ; Nicolics, Johann ; Weiss, Laurenz Reliability analysis of Cu wire bonds in microelectronic packagesKonferenzbeitrag Inproceedings2016
17Lederer, Martin ; Khatibi, Golta On the relation between the energy of a distorted crystal lattice and the bending modulus of strain gradient elasticityKonferenzbeitrag Inproceedings2015
18Lederer, Martin ; Khatibi, Golta On the elastic deformation around holes, dislocations and cracks evaluated within a finite strain approachPräsentation Presentation2017
19Lederer, Martin ; Kotas, Agnieszka Betwar ; Khatibi, Golta ; Danninger, Herbert On crack propagation in homogeneous and composite materials under mixed mode loading conditionsKonferenzbeitrag Inproceedings2020
20Walter, Thomas Methods for evaluation of thin film adhesion in power electronicsPräsentation Presentation2019