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| | Preview | Author(s) | Title | Type | Issue Date |
| 1 | | Walter, Thomas | Hochbeschleunigte Lebensdauerprüfung für elektronische Bauteile | Presentation Vortrag | 14-Nov-2023 |
| 2 | | Wodak, Irina ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped Flux | Presentation Vortrag | 25-Oct-2023 |
| 3 | | Khatibi Damavandi, Golta ; Czerny, Bernhard | Lebensdauerprognose von IGBT-Modulen in Rekordzeit mit BAMFIT-Bondtester | Special Contribution Spezialbeitrag | Oct-2023 |
| 4 | | Wodak, Irina ; Khatibi Damavandi, Golta ; Yakymovych, Andriy | Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticles | Presentation Vortrag | Oct-2023 |
| 5 | | Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Graphene and carbon nanotubes functionality in Sn-Ag-Cu solder alloy | Presentation Vortrag | 7-Sep-2023 |
| 6 | | Khatibi Damavandi, Golta ; Walter, Thomas | Beschleunigte Prüfmethode für Lotverbindungen in der Elektronik | Special Contribution Spezialbeitrag | Sep-2023 |
| 7 | | Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas | Alternative POF-Based Accelerated Testing | Presentation Vortrag | 18-Apr-2023 |
| 8 | | Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas ; Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Zareghomsheh, Mohammad | PoF Based Accelerated Testing | Presentation Vortrag | Jun-2022 |
| 9 | | Khatibi Damavandi, Golta | Reliability Assessment of Thin Films and Multilayers in Electronic Packages | Presentation Vortrag | 26-May-2022 |
| 10 | | Wodak, Irina ; Yakymovych, Andriy ; Strutz P. ; Wimmer C. ; Yerbol S. ; Khatibi Damavandi, Golta | Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints | Presentation Vortrag | 4-May-2022 |
| 11 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Insights into synthesis of nanosized Ni and Fe particles by chemical reduction method | Presentation Vortrag | 4-May-2022 |
| 12 | | Yakymovych, Andriy ; Plevachuk, Yuriy ; Svec, P. ; Svec Sr. P. ; Sklyarchuk V. | Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites | Presentation Vortrag | 4-May-2022 |
| 13 | | Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi Damavandi, Golta | Accelerated Fatigue Testing and Lifetime Modelling of Solder Interconnects in Power Electronics | Presentation Vortrag | 2022 |
| 14 | | Khatibi Damavandi, Golta ; Czerny, Bernhard | Mechanical lifetime testing of wire bonds vs power cycling | Presentation Vortrag | 2022 |
| 15 | | Betzwar Kotas, Agnieszka Monika ; Lederer, Martin ; Khatibi Damavandi, Golta ; Boczkal, Grzegorz ; Perek-Nowak M. | Mechanical Reliability of Lead-Free Solder Joints: Comparative Study of Sn3.5Ag versus SnSbAg Solder Alloy | Presentation Vortrag | 2022 |
| 16 | | Walter, Thomas ; Zareghomsheh, Mohammad ; Khatibi, Golta ; Popok, Vladimir ; Kristensen, Peter ; Schwarz, Sabine | Interfacial adhesion strength of III-N heterostructures | Präsentation Presentation | 2021 |
| 17 | | Khatibi, Golta | Reliability and lifetime assessment in power electronics | Präsentation Presentation | 2021 |
| 18 | | Haddadi, Bahram ; Jordan, Christian ; Wedl, Günter ; Harasek, Michael ; Gasser, Christoph ; Lendl, Bernhard | Endbericht Projekt "LaserEye" | Bericht Report | 2020 |
| 19 | | Czerny, Bernhard | Wire bond reliability and accelerated mechanical testing | Präsentation Presentation | 2019 |
| 20 | | Khatibi, Golta | Alternative accelerated qualification methods for electronic components | Präsentation Presentation | 2019 |
