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| | Preview | Author(s) | Title | Type | Issue Date |
| 1 | | Walter, Thomas | Hochbeschleunigte Lebensdauerprüfung für elektronische Bauteile | Presentation Vortrag | 14-Nov-2023 |
| 2 |  | Wodak, Irina ; Yakymovych, Andriy ; Svec, Peter ; Orovcik, Lubomir ; Khatibi, Golta | Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints | Article Artikel    | Nov-2023 |
| 3 |  | Walter, Thomas ; Khatibi, G. ; Betzwar Kotas, A. ; Kretschy, Nicole | In-situ delamination detection in multi-layered semiconductor packages | Article Artikel | Nov-2023 |
| 4 | | Wodak, Irina ; Yakymovych, Andriy ; Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped Flux | Presentation Vortrag | 25-Oct-2023 |
| 5 | | Khatibi Damavandi, Golta ; Czerny, Bernhard | Lebensdauerprognose von IGBT-Modulen in Rekordzeit mit BAMFIT-Bondtester | Special Contribution Spezialbeitrag | Oct-2023 |
| 6 | | Wodak, Irina ; Khatibi Damavandi, Golta ; Yakymovych, Andriy | Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticles | Presentation Vortrag | Oct-2023 |
| 7 | | Khodabakhshi, Farzad ; Khatibi Damavandi, Golta | Graphene and carbon nanotubes functionality in Sn-Ag-Cu solder alloy | Presentation Vortrag | 7-Sep-2023 |
| 8 | | Khatibi Damavandi, Golta ; Walter, Thomas | Beschleunigte Prüfmethode für Lotverbindungen in der Elektronik | Special Contribution Spezialbeitrag | Sep-2023 |
| 9 | | Delshadmanesh, Mitra ; Lederer, Martin ; Frank, Johannes ; Khatibi Damavandi, Golta | Study of fatigue life and fatigue notch sensitivity of biocompatible Co-Cr alloy L605 | Inproceedings Konferenzbeitrag | Sep-2023 |
| 10 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi, Golta | Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux | Inproceedings Konferenzbeitrag | 6-Jul-2023 |
| 11 | | Hartleb, Moritz ; Imrich , Peter ; Zechner, Johannes ; Walter, Thomas ; Khatibi Damavandi, Golta | Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components | Inproceedings Konferenzbeitrag | 6-Jul-2023 |
| 12 | | Wodak, Irina ; Yakymovych, Andriy ; Khatibi Damavandi, Golta | Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped Flux | Inproceedings Konferenzbeitrag | 6-Jul-2023 |
| 13 | | Walter, Thomas ; Khatibi Damavandi, Golta | In-situ Delaminationsmessung in Mehrlagenstrukturen der Elektronik | Inproceedings Konferenzbeitrag | Jun-2023 |
| 14 |  | Yakymovych, Andriy ; Shtablavyi, Ihor | Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States | Article Artikel | Jun-2023 |
| 15 | | Khatibi Damavandi, Golta ; Czerny, Bernhard ; Walter, Thomas | Alternative POF-Based Accelerated Testing | Presentation Vortrag | 18-Apr-2023 |
| 16 |  | Lederer, Martin ; Betzwar Kotas, Agnieszka Monika ; Khatibi, G. | Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element Analysis | Article Artikel | Mar-2023 |
| 17 | | Yakymovych, Andriy ; Goh, Yingxin ; Kamaruzzaman L.S. ; Wodak, Irina ; Khatibi Damavandi, Golta | Hybrid solder joints: Effects of Fe nanoparticle-doped flux on morphology and hardness of SAC305 solder joints | Inproceedings Konferenzbeitrag | 2023 |
| 18 |  | Plevachuk, Yuriy ; Švec, Peter Sr ; Švec, Peter ; Orovcik, Lubomir ; Bajana, Otto ; Yakymovych, Andriy ; Rud, Alexander | Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites | Article Artikel | 2023 |
| 19 | | Zareghomsheh, Mohammad ; Khatibi, Golta | The Activation Energy of Strain Bursts during Nanoindentation Creep on Polyethylene | Article Artikel | 23-Dec-2022 |
| 20 | | Wodak, Irina ; Yakymovych, Andriy ; Strutz, Patricia ; Wimmer, C. ; Syrym, Yerbol ; Khatibi Damavandi, Golta | Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints | Inproceedings Konferenzbeitrag | Aug-2022 |
