Name Card

Full name Familienname, Vorname
Karunamurthy, Balamurugan
 

Own Publications Eigene Publikationen

Results 1-10 of 10 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Hoffmann, Paul ; Moser, Sebastian ; Kofler, Corinna ; Nelhiebel, Michael ; Tscharnuter, Daniel ; Karunamurthy, Balamurugan ; Pettermann, Heinz E. ; Todt, Melanie Thermomechanical fatigue damage modeling and material parameter calibration for thin film metallizationsArtikel Article 2022
2Hoffmann, Paul ; Moser, Sebastian ; Kofler, Corinna ; Nelhiebel, Michael ; Tscharnuter, Daniel ; Karunamurthy, Balamurugan ; Pettermann, Heinz ; Todt, Melanie Thermo-mechanical fatigue damage modeling and material parameter calibration for thin film metallizationsPresentation Vortrag2022
3Hoffmann, Paul ; Nelhiebel, Michael ; Karunamurthy, Balamurugan ; Pettermann, Heinz E. ; Todt, Melanie Simulation of Fatigue Damage in Clusters of DMOS Cells Subjected to Non-Uniform Transient Thermo-Mechnical LoadingKonferenzbeitrag Inproceedings2020
4Hoffmann, Paul ; Springer, Martin ; Todt, Melanie ; Karunamurthy, Balamurugan ; Nelhiebel, Michael ; Pettermann, Heinz E. Simulation of fatigue damage in power semiconductors subjected to transient thermo-mechanical loadingPräsentation Presentation2019
5Springer, Martin ; Pettermann, Heinz E. ; Nelhiebel, Michael ; Karunamurthy, Balamurugan FEM - Fatigue Modeling Approach for Damage Propagation and Lifetime EstimationPräsentation Presentation2015
6Springer, Martin ; Pettermann, Heinz E. ; Nelhiebel, Michael ; Karunamurthy, Balamurugan Damage Mechanics for Reliability: FEM-Predictions of Material Degradation in Cu Power MetallizationPräsentation Presentation2015
7Kravchenko, Grygoriy ; Karunamurthy, Balamurugan ; Pettermann, Heinz E. FEM Study of Fatigue Crack Growth in a Power Semiconductor Chip Subjected to Transient Thermal LoadingKonferenzbeitrag Inproceedings2014
8Kravchenko, Grygoriy ; Karunamurthy, Balamurugan ; Nelhiebel, Michael ; Pettermann, Heinz E. Finite Element Analysis of Fatigue cracks Formation in Power Metallization of a Semiconductor Device Subjected to Active CyclingKonferenzbeitrag Inproceedings2013
9Kravchenko, Grygoriy ; Pettermann, Heinz E. ; Karunamurthy, Balamurugan ; Nelhiebel, Michael ; Wöhlert, Stefan Numerical Simulation of Crack Problems in Semiconductor DevicesPräsentation Presentation2012
10Gager, Jakob ; Karunamurthy, Balamurugan ; Nelhiebel, Michael ; Pettermann, Heinz E. Finite Element Based Simulations of Interface Cracks in Semiconductor Devices - A Study on Geometry Parameters and Delamination ConfigurationsKonferenzbeitrag Inproceedings2010