Full name Familienname, Vorname
Evanschitzky, P.
 

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PreviewAuthor(s)TitleTypeIssue Date
1Baer, E. ; Evanschitzky, P. ; Lorenz, J. ; Roger, F. ; Minixhofer, R. ; Filipovic, L. ; de Orio, R.L. ; Selberherr, S. Coupled Simulation to Determine the Impact of Across Wafer Variations in Oxide PECVD on Electrical and Reliability Parameters of Through-Silicon ViasArtikel Article 2015
2Baer, Eberhard ; Evanschitzky, P. ; Lorenz, J. ; Roger, Frederic ; Minixhofer, R. ; Filipovic, Lado ; Orio, Roberto ; Selberherr, Siegfried Coupled Simulation to Determine Across Wafer Variations for Electrical and Reliability Parameters of Through-Silicon VIAsKonferenzbeitrag Inproceedings 2014
3Filipovic, L. ; Rudolf, F. ; Baer, E. ; Evanschitzky, P. ; Lorenz, J. ; Roger, F. ; Singulani, A. ; Minixhofer, R. ; Selberherr, S. Three-dimensional simulation for the reliability and electrical performance of through-silicon viasKonferenzbeitrag Inproceedings2014
4Lorenz, J. ; Bär, E. ; Clees, T. ; Evanschitzky, P. ; Jancke, Roland ; Kampen, C. ; Paschen, U. ; Salzig, C. ; Selberherr, Siegfried Hierarchical Simulation of Process Variations and Their Impact on Circuits and Systems: ResultsArtikel Article 16-Jun-2011