Full name Familienname, Vorname
Pelzl, J.
 

Results 1-6 of 6 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Pelzl, J. ; Kijamnajsuk, P. ; Chirtoc, M. ; Horny, N. ; Eisenmenger-Sittner, C. Correlation Between Thermal Interface Conductance and Mechanical Adhesion Strength in Cu-Coated Glassy CarbonArtikel Article2015
2Kijamnajsuk, P. ; Pelzl, J. ; Chirtoc, M. ; Horny, N. ; Schäfer, D. ; Eisenmenger-Sittner, C. Photothermal Evidence of Laterally Inhomogeneous Interfacial Thermal Resistance in Copper-Coated Carbon SamplesArtikel Article2012
3Kijamnajsuk, P. ; Chirtoc, M. ; Möller, Marc ; Schäfer, David ; Eisenmenger-Sittner, Christoph ; Spoddig, D. ; Meckenstock, R. ; Pelzl, J. Thermal interface resistance of metal films on insulator and semi-conductor substrates measured by thermal wave techniquesPräsentation Presentation2011
4Kijamnajsuk, P. ; Chirtoc, M. ; Horny, N. ; Pelzl, J. ; Schäfer, D. ; Eisenmenger-Sittner, Christoph Experimental Evidence Of Laterally Inhomogeneous Thermal Interface Resistance In Copper Coated Carbon SamplesPräsentation Presentation2011
5Neubauer, E. ; Chotikaprakhan, S. ; Dietzel, D. ; Bein, B.K. ; Pelzl, J. ; Eisenmenger-Sittner, Christoph ; Schrank, C. ; Korb, Gerd Loss of adhesion strength of PVD Cu films on carbon substrates after heat treatment and correlated effects on the thermal interface propertiesArtikel Article 2006
6Dietzel, D. ; Chotikaprakhan, S. ; Bangert, Herwig ; Eisenmenger-Sittner, Christoph ; Neubauer, Erich ; Bein, B.K. ; Pelzl, J. Thermische Charakterisierung von Kupferbeschichtungen im Kupfer-Kohlenstoff-Verbund mittels modulierter ThermoreflexionPräsentation Presentation2003