Speckmann, C., Angeletti, A., Kývala, L., Lamprecht, D., Herterich, F., Mangler, C., Filipovic, L., Dellago, C., Franchini, C., & Kotakoski, J. (2025). Electron‐Beam‐Induced Adatom‐Vacancy‐Complexes in Mono‐ and Bilayer Phosphorene. Advanced Materials Interfaces, Article 2400784. https://doi.org/10.1002/admi.202400784 ( reposiTUm)

Faber, T., Filipovic, L., & Koster, L. J. A. (2024). The Hot Phonon Bottleneck Effect in Metal Halide Perovskites. Journal of Physical Chemistry Letters, 15, 12601–12607. https://doi.org/10.1021/acs.jpclett.4c03133 ( reposiTUm)

Shao, H., Reiter, T., Chen, R., Li, J., Hu, Z., Wei, Y., Li, L., & Filipovic, L. (2024). Loading Effect during SiGe/Si Stack Selective Isotropic Etching for Gate-All-Around Transistors. ACS Applied Electronic Materials, 6(11), 8124–8133. https://doi.org/10.1021/acsaelm.4c01462 ( reposiTUm)

Hu, Z., Li, J., Chen, R., Shang, D., Wei, Y., Wang, Z., Li, L., & Filipovic, L. (2024). A Two-Step Dry Etching Model for Non-Uniform Etching Profile in Gate-All-Around Field-Effect Transistor Manufacturing. Small, 20(51), Article 2405574. https://doi.org/10.1002/smll.202405574 ( reposiTUm)

Reiter, T., Aguinsky, L. F., Souza Berti Rodrigues, F., Weinbub, J., Hössinger, A., & Filipovic, L. (2024). Modeling the Impact of Incomplete Conformality During Atomic Layer Processing. Solid-State Electronics, 211, Article 108816. https://doi.org/10.1016/j.sse.2023.108816 ( reposiTUm)

Propst, D., Joudi, W., Längle, M., Madsen, J., Kofler, C., Mayer, B., Lamprecht, D., Mangler, C., Filipovic, L., Susi, T., & Kotakoski, J. (2024). Automated image acquisition and analysis of graphene and hexagonal boron nitride from pristine to highly defective and amorphous structures. Scientific Reports, 14(1), Article 26939. https://doi.org/10.1038/s41598-024-77740-9 ( reposiTUm)

Zarate-Galvez, S., Garcia-Barrientos, A., Lastras-Martinez, L. F., Cardenas-Juarez, M., Macias-Velasquez, S., Filipovic, L., & Arce-Casas, A. (2023). Optimization of Doping Concentration to Obtain High Internal Quantum Efficiency and Wavelength Stability in An InGaN/GaN Blue Light-Emitting Diode. ECS Journal of Solid State Science and Technology, 12(7), Article 076014. https://doi.org/10.1149/2162-8777/ace7c4 ( reposiTUm)

Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., & Filipovic, L. (2023). Effect of Mask Geometry Variation on Plasma Etching Profiles. Micromachines, 14(3), Article 665. https://doi.org/10.3390/mi14030665 ( reposiTUm)

Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., & Filipovic, L. (2023). Effect of Mask Geometry Variation on Plasma Etching Profiles. Micromachines, 14(3), Article 665. https://doi.org/10.3390/mi14030665 ( reposiTUm)

Filipovic, L., Baumgartner, O., Klemenschits, X., Piso, J., Bobinac, J., Reiter, T., Strof, G., Rzepa, G., Stanojevic, Z., & Karner, M. (2023). DTCO flow for air spacer generation and its impact on power and performance at N7. Solid-State Electronics, 199, Article 108527. https://doi.org/10.1016/j.sse.2022.108527 ( reposiTUm)

Faber, T., Filipovic, L., & Koster, L. J. A. (2023). The Role of Thermalization in the Cooling Dynamics of Hot Carrier Solar Cells. Solar RRL, 7(13), 1–9. https://doi.org/10.1002/solr.202300140 ( reposiTUm)

Yazdanpanah Goharrizi, A., Mojarani Barzoki, A., Selberherr, S., & Filipovic, L. (2023). A Theoretical Study of Armchair Antimonene Nanoribbons in the Presence of Uniaxial Strain Based on First-Principles Calculations. ACS Applied Electronic Materials, 5(8), 4514–4522. https://doi.org/10.1021/acsaelm.3c00686 ( reposiTUm)

Garcia-Barrientos, A., Nikolova, N., Filipovic, L., Gutierez-D., E. A., Serrano, V., Macias-Velasquez, S., & Zarate-Galvez, S. (2023). Numerical simulations of space charge waves amplification using negative differential conductance in strained Si/SiGe at 4.2 K. Crystals, 13(9), Article 1398. https://doi.org/10.3390/cryst13091398 ( reposiTUm)

Aguinsky, L. F., Souza Berti Rodrigues, F., Reiter, T., Klemenschits, X., Filipovic, L., Hössinger, A., & Weinbub, J. (2023). Modeling Incomplete Conformality During Atomic Layer Deposition in High Aspect Ratio Structures. Solid-State Electronics, 201, Article 108584. https://doi.org/10.1016/j.sse.2022.108584 ( reposiTUm)

Filipovic, L., & Grasser, T. (2022). Special Issue on Miniaturized Transistors, Volume II. Micromachines, 13(4), 603. https://doi.org/10.3390/mi13040603 ( reposiTUm)

Reiter, T., Klemenschits, X., & Filipovic, L. (2022). Impact of Plasma Induced Damage on the Fabrication of 3D NAND Flash Memory. Solid-State Electronics, 192(108261), 108261. https://doi.org/10.1016/j.sse.2022.108261 ( reposiTUm)

Waltl, M., Knobloch, T., Tselios, K., Filipovic, L., Stampfer, B., Hernandez, Y., Waldhör, D., Illarionov, Y., Kaczer, B., & Grasser, T. (2022). Perspective of 2D Integrated Electronic Circuits: Scientific Pipe Dream or Disruptive Technology? Advanced Materials, 34(48), 2201082. https://doi.org/10.1002/adma.202201082 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2022). Application of two-dimensional materials towards CMOS-integrated gas sensors. Nanomaterials, 12(20), Article 3651. https://doi.org/10.3390/nano12203651 ( reposiTUm)

Knobloch, T., Uzlu, B., Illarionov, Y., Wang, Z., Otto, M., Filipovic, L., Waltl, M., Neumaier, D., Lemme, M. C., & Grasser, T. (2022). Improving stability in two-dimensional transistors with amorphous gate oxides by Fermi-level tuning. Nature Electronics, 5(6), 356–366. https://doi.org/10.1038/s41928-022-00768-0 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2021). Microstructure and Granularity Effects in Electromigration. IEEE Journal of the Electron Devices Society, 9, 476–483. https://doi.org/10.1109/jeds.2020.3044112 ( reposiTUm)

Fatemeh, S., Moradinasab, M., Schwalke, U., & Filipovic, L. (2021). Superior Sensitivity and Optical Response of Blue Phosphorene and Its Doped Systems for Gas Sensing Applications. ACS Omega, 6(29), 18770–18781. https://doi.org/10.1021/acsomega.1c01898 ( reposiTUm)

Filipovic, L. (2021). Theoretical Examination of Thermo-Migration in Novel Platinum Microheaters. Microelectronics Reliability, 123(114219), 114219. https://doi.org/10.1016/j.microrel.2021.114219 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2021). Geometric Advection and Its Application in the Emulation of High Aspect Ratio Structures. Computer Methods in Applied Mechanics and Engineering, 386(114196), 114196. https://doi.org/10.1016/j.cma.2021.114196 ( reposiTUm)

Filipovic, L. (2021). Theoretical examination of thermo-migration in novel platinum microheaters. Microelectronics Reliability, 123, 1–14. https://doi.org/10.1016/j.microrel.2021.114219 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2019). Thermo-Electro-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors. Materials, 12(15), 2410. https://doi.org/10.3390/ma12152410 ( reposiTUm)

Filipovic, L., & Grasser, T. (2019). Editorial for the Special Issue on Miniaturized Transistors. Micromachines, 10(5), 300. https://doi.org/10.3390/mi10050300 ( reposiTUm)

Filipovic, L. (2019). A Method for Simulating the Influence of Grain Boundaries and Material Interfaces on Electromigration. Microelectronics Reliability, 97, 38–52. https://doi.org/10.1016/j.microrel.2019.04.005 ( reposiTUm)

Lahlalia, A., Le Neel, O., Shankar, R., Selberherr, S., & Filipovic, L. (2019). Improved Sensing Capability of Integrated Semiconducting Metal Oxide Gas Sensor Devices. Sensors, 19(2), 374. https://doi.org/10.3390/s19020374 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2019). Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review. Micromachines, 105–135. http://hdl.handle.net/20.500.12708/30045 ( reposiTUm)

Filipovic, L., & Lahlalia, A. (2018). Review—System-on-Chip SMO Gas Sensor Integration in Advanced CMOS Technology. Journal of The Electrochemical Society, 165(16), 862–879. https://doi.org/10.1149/2.0731816jes ( reposiTUm)

Lahlalia, A., Le Neel, O., Shankar, R., Kam, S. Y., & Filipovic, L. (2018). Electro-Thermal Simulation & Characterization of a Microheater for SMO Gas Sensors. Journal of Microelectromechanical Systems, 27(3), 529–537. https://doi.org/10.1109/jmems.2018.2822942 ( reposiTUm)

Lahlalia, A., Filipovic, L., & Selberherr, S. (2018). Modeling and Simulation of Novel Semiconducting Metal Oxide Gas Sensors for Wearable Devices. IEEE Sensors Journal, 18(5), 1960–1970. https://doi.org/10.1109/jsen.2018.2790001 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2018). Modeling of Gate Stack Patterning for Advanced Technology Nodes: A Review. Micromachines, 9(12), Article 631. https://doi.org/10.3390/mi9120631 ( reposiTUm)

Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., & Selberherr, S. (2017). Framework to Model Neutral Particle Flux in Convex High Aspect Ratio Structures using One-Dimensional Radiosity. Solid-State Electronics, 128, 141–147. https://doi.org/10.1016/j.sse.2016.10.029 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2016). Stress in Three-Dimensionally Integrated Sensor Systems. Microelectronics Reliability, 61, 3–10. https://doi.org/10.1016/j.microrel.2015.09.013 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2016). Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology. IEEE Transactions on Device and Materials Reliability, 16(4), 483–495. https://doi.org/10.1109/tdmr.2016.2625461 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2015). Performance and Stress Analysis of Metal Oxide Films for CMOS-Integrated Gas Sensors. Sensors, 15(4), 7206–7227. https://doi.org/10.3390/s150407206 ( reposiTUm)

Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., de Orio, R. L., & Selberherr, S. (2015). Coupled Simulation to Determine the Impact of Across Wafer Variations in Oxide PECVD on Electrical and Reliability Parameters of Through-Silicon Vias. Microelectronic Engineering, 137, 141–145. https://doi.org/10.1016/j.mee.2014.11.014 ( reposiTUm)

Filipovic, L., Singulani, A. P., Roger, F., Carniello, S., & Selberherr, S. (2015). Intrinsic Stress Analysis of Tungsten-Lined Open TSVs. Microelectronics Reliability, 55(9–10), 1843–1848. https://doi.org/10.1016/j.microrel.2015.06.014 ( reposiTUm)

Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., & Schrank, F. (2014). Methods of simulating thin film deposition using spray pyrolysis techniques. Microelectronic Engineering, 117, 57–66. https://doi.org/10.1016/j.mee.2013.12.025 ( reposiTUm)

Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., & Grogger, W. (2014). Modeling the Growth of Tin Dioxide Using Spray Pyrolysis Deposition for Gas Sensor Applications. IEEE Transactions on Semiconductor Manufacturing, 27(2), 269–277. https://doi.org/10.1109/tsm.2014.2298883 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2014). The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias. Microelectronics Reliability, 54(9–10), 1953–1958. https://doi.org/10.1016/j.microrel.2014.07.014 ( reposiTUm)

Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Seinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., & Grogger, W. (2013). A Method for Simulating Spray Pyrolysis Deposition in the Level Set Framework. Engineering Letters, 21(4), 224–240. http://hdl.handle.net/20.500.12708/155538 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2013). A Method for Simulating Atomic Force Microscope Nanolithography in the Level Set Framework. Microelectronic Engineering, 107, 23–32. https://doi.org/10.1016/j.mee.2013.02.083 ( reposiTUm)

Filipovic, L. (2024). Merging Reactor and Feature Scales for Plasma Etch Modeling. In IEEE NANO 2024 Book of Abstracts (pp. 120–120). ( reposiTUm)

Filipovic, L., & Reiter, T. (2024). Multi-Scale Model for High Aspect Ratio TiN Etching in a Cl₂/Ar Inductively Coupled Plasma. In SICT 2024, Plasma Tech 2024 and Tribology 2024 Joint International Conferences: Book of Abstracts (pp. 67–67). ( reposiTUm)

Filipovic, L. (2024). Modeling and simulation of ALD in a level set framework. In EFDS: Program Booklet: ALD for Industry (pp. 24–24). ( reposiTUm)

Gull, J., Filipovic, L., & Kosina, H. (2024). Electron-Electron Scattering in Non-Parabolic Transport Models. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4). https://doi.org/10.1109/SISPAD62626.2024.10733120 ( reposiTUm)

Filipovic, L. (2024). Efficient Multi-Scale Modeling of Semiconductor Device Fabrication. In The 5th International Congress on Advanced Materials Sciences and Engineering: Abstract Book (pp. 40–40). https://doi.org/10.34726/8759 ( reposiTUm)

Bamer, B., Leroch, S., Hossinger, A., & Filipovic, L. (2024). Cluster-Based Semi-Empirical Model for Dopant Activation in Silicon Carbide. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4). https://doi.org/10.1109/SISPAD62626.2024.10732978 ( reposiTUm)

Reiter, T., Toifl, A., Kong, S. W., Hoessinger, A., & Filipovic, L. (2024). Impact of Ion Energy and Yield in Oblique Ion Beam Etching Process for Blazed Gratings. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4). https://doi.org/10.1109/SISPAD62626.2024.10733316 ( reposiTUm)

Bamer, B., Hoessinger, A., & Filipovic, L. (2024). Cluster-based model for dopant activation in SiC. In MESS24: Microelectronic Systems Symposium (pp. 47–47). http://hdl.handle.net/20.500.12708/212125 ( reposiTUm)

Hu, Z., Filipovic, L., Li, J., Wang, L., Wu, Z., Chen, R., Wei, Y., & Li, L. (2024). Modeling Non-Uniformity During Two-Step Dry Etching of Si/SiGe Stacks for Gate-All-Around FETs. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4). https://doi.org/10.1109/SISPAD62626.2024.10733200 ( reposiTUm)

Bamer, B., Leroch, S., Hoessinger, A., & Filipovic, L. (2024). Cluster-based multivariate spline model for dopant activation in SiC. In AMaSiS 2024: Applied Mathematics and Simulation for Semiconductor Devices (pp. 20–20). http://hdl.handle.net/20.500.12708/212126 ( reposiTUm)

Lamprecht, D., Capin, M., Benzer, A., Längle, M., Mangler, C., Kotakoski, J., & Filipovic, L. (2024). Room temperature gas sensing based on substitutional atom doped MoS₂. In XXXVIth International Winterschool on Electronic Properties of Novel Materials: Molecular Nanostructures: Program (pp. 31–31). http://hdl.handle.net/20.500.12708/212512 ( reposiTUm)

Stella, R., Leroch, S., Hössinger, A., Waldhör, D., & Filipovic, L. (2024). Atomistic Study of 4H-SiC Using Ab Initio and Machine Learning Techniques. In PRiME 2024 October 6, 2024 - October 11, 2024 Honolulu, USA. PRiME 2024, Honolulu, HI, United States of America (the). https://doi.org/10.1149/MA2024-02201801mtgabs ( reposiTUm)

Leroch, S., Stella, R., Hössinger, A., & Filipovic, L. (2024). MD Simulation of Epitaxial Recrystallization and Defect Structure of Al-Implanted 4H-SiC. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4). https://doi.org/10.1109/SISPAD62626.2024.10733052 ( reposiTUm)

Filipovic, L., Reiter, T., Piso, J., & Kostal, R. (2024). Equipment-Informed Machine Learning-Assisted Feature-Scale Plasma Etching Model. In 2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 1–4). https://doi.org/10.1109/SISPAD62626.2024.10733099 ( reposiTUm)

Filipovic, L., Bamer, B., Leroch, S., Reiter, T., Stella, R., & Hoessinger, A. (2024). Multi-Scale Process TCAD for Advanced Semiconductor Fabrication. In MESS24: Microelectronic Systems Symposium (pp. 37–37). http://hdl.handle.net/20.500.12708/212137 ( reposiTUm)

Filipovic, L., Bobinac, J., Piso, J., & Reiter, T. (2023). Physics-Informed Compact Model for SF6/O2 Plasma Etching. In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 73–76). IEEE. https://doi.org/10.23919/SISPAD57422.2023.10319479 ( reposiTUm)

Reiter, T., Toifl, A., Hössinger, A., & Filipovic, L. (2023). Modeling Oxide Regrowth During Selective Etching in Vertical 3D NAND Structures. In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 85–88). IEEE. https://doi.org/10.23919/SISPAD57422.2023.10319506 ( reposiTUm)

Reiter, T., & Filipovic, L. (2023). Fast 3D Flux Calculation using Monte Carlo Ray Tracing on GPUs. In S. Y. Yurish (Ed.), Proceedings of the International Conference on Microelectronic Devices and Technologies (MicDAT ’2023)) (pp. 67–72). https://doi.org/10.13140/RG.2.2.13265.71524 ( reposiTUm)

Filipovic, L., & Lacerda de Orio, R. (2023). Electromigration Reliability of Buried Power Rails in Vertically Stacked Devices. In 2023 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–6). IEEE. https://doi.org/10.1109/IIRW59383.2023.10477689 ( reposiTUm)

Filipovic, L., Reiter, T., Klemenschits, X., Leroch, S., Stella, R., Baumgartner, O., & Hössinger, A. (2023). Process Simulation in Micro- and Nano-Electronics. In Book of abstracts of the International Workshop on Computational Nanotechnology 2023 (pp. 38–39). http://hdl.handle.net/20.500.12708/189406 ( reposiTUm)

Leroch, S., Stella, R., Hössinger, A., & Filipovic, L. (2023). Molecular Dynamics Study of Al Implantation in 4H-SiC. In 2023 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 185–188). IEEE. https://doi.org/10.23919/SISPAD57422.2023.10319554 ( reposiTUm)

Reiter, T., Klemenschits, X., & Filipovic, L. (2022). Modeling Plasma-Induced Damage During the Dry Etching of Silicon. In 2022 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–5). IEEE. https://doi.org/10.1109/IIRW56459.2022.10032764 ( reposiTUm)

Gollner, L., Steiner, R., & Filipovic, L. (2022). Study of Phonon-limited Electron Transport in Monolayer MoS2. In Microelectronic Devices and Technologies Proceedings of the 4rd International Conference on Microelectronic Devices and Technologies (MicDAT 2022) (pp. 74–78). http://hdl.handle.net/20.500.12708/153563 ( reposiTUm)

Bobinac, J., Reiter, T., Piso, J., Klemenschits, X., Baumgartner, O., Stanojevic, Z., Strof, G., Karner, M., & Filipovic, L. (2022). Impact of Mask Tapering on SF6/O2 Plasma Etching. In Microelectronic Devices and Technologies: Proceedings of the 4rd International Conference on Microelectronic Devices and Technologies (MicDAT ’2022) (pp. 90–94). http://hdl.handle.net/20.500.12708/153562 ( reposiTUm)

Filipovic, L., Baumgartner, O., Piso, J., Bobinac, J., Reiter, T., Strof, G., Rzepa, G., Stanojevic, Z., & Karner, M. (2022). DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7. In SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet (pp. 34–35). http://hdl.handle.net/20.500.12708/153577 ( reposiTUm)

Aguinsky, L. F., Rodrigues, F., Klemenschits, X., Filipovic, L., Hössinger, A., & Weinbub, J. (2022). Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio Structures. In Proceedings of the International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) (pp. 40–41). http://hdl.handle.net/20.500.12708/153575 ( reposiTUm)

Filipovic, L. (2022). Reliability of Platinum Microheater Geometries for MEMS-Based Gas Sensors. In 2022 IEEE International Integrated Reliability Workshop (IIRW) (pp. 1–6). IEEE. https://doi.org/10.1109/IIRW56459.2022.10032744 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2021). Gas Sensing with Two-Dimensional Materials Beyond Graphene. In 2021 IEEE 32nd International Conference on Microelectronics (MIEL). 2021 IEEE 32nd International Conference on Microelectronics (MIEL), Nis, Serbia. https://doi.org/10.1109/miel52794.2021.9569088 ( reposiTUm)

Filipovic, L., & Klemenschits, X. (2021). Fast Model for Deposition in Trenches using Geometric Advection. In 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, TX, United States of America (the). IEEE. https://doi.org/10.1109/sispad54002.2021.9592595 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2021). Combined Process Simulation and Emulation of an SRAM Cell of the 5nm Technology Node. In 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2021 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Dallas, TX, United States of America (the). IEEE. https://doi.org/10.1109/sispad54002.2021.9592605 ( reposiTUm)

Filipovic, L. (2021). Modeling and Simulation of Atomic Layer Deposition. In Proceedings of the EFDS Workshop on Simulation for ALD 2021 (p. 9). http://hdl.handle.net/20.500.12708/77354 ( reposiTUm)

Filipovic, L. (2021). Reliability and Stability of MEMS Microheaters for Gas Sensors. In 2021 IEEE International Integrated Reliability Workshop (IIRW). 2021 IEEE International Integrated Reliability Workshop (IIRW), South Lake Tahoe, United States of America (the). https://doi.org/10.1109/iirw53245.2021.9635162 ( reposiTUm)

Reiter, T., Klemenschits, X., & Filipovic, L. (2021). Impact of High-Aspect-Ratio Etching Damage on Selective Epitaxial Silicon Growth in 3D NAND Flash Memory. In B. Cretu (Ed.), 2021 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EuroSOI-ULIS). IEEE. https://doi.org/10.1109/eurosoi-ulis53016.2021.9560693 ( reposiTUm)

Filipovic, L., & Selberher, S. (2020). Granularity Effects in Electromigration. In 2020 IEEE Latin America Electron Devices Conference (LAEDC). IEEE Latin America Electron Devices Conference (LAEDC), San Jose, Costa Rica. https://doi.org/10.1109/laedc49063.2020.9072963 ( reposiTUm)

Filipovic, L. (2020). Electromigration Model for Platinum Hotplates. In 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan. IEEE. https://doi.org/10.23919/sispad49475.2020.9241645 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2020). Geometric Advection Algorithm for Process Emulation. In 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Tokyo, Japan. IEEE. https://doi.org/10.23919/sispad49475.2020.9241678 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2020). Integration of Gas Sensors with CMOS Technology. In 2020 4th IEEE Electron Devices Technology & Manufacturing Conference (EDTM). IEEE Electron Devices Technology and Manufacturing Conference (EDTM), Toyama, Japan. https://doi.org/10.1109/edtm47692.2020.9117828 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2019). CMOS-Compatible Gas Sensors. In 2019 IEEE 31st International Conference on Microelectronics (MIEL). International Conference on Microelectronics (MIEL), Nis, Serbia. https://doi.org/10.1109/miel.2019.8889585 ( reposiTUm)

Klemenschits, X., Manstetten, P., Filipovic, L., & Selberherr, S. (2019). Process Simulation in the Browser: Porting ViennaTS using WebAssembly. In 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy. IEEE. https://doi.org/10.1109/sispad.2019.8870374 ( reposiTUm)

Filipovic, L. (2019). Modeling and Simulation of Atomic Layer Deposition. In 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Udine, Italy. IEEE. https://doi.org/10.1109/sispad.2019.8870462 ( reposiTUm)

Filipovic, L., & Orio, R. (2019). Electromigration in Nano-Interconnects. In Book of Abstracts of the Workshop on High Performance TCAD (WHPTCAD) (p. 2). http://hdl.handle.net/20.500.12708/76636 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2019). Fast Volume Evaluation on Sparse Level Sets. In Book of Abstracts of the International Workshop on Computational Nanotechnology (IWCN 2019) (pp. 113–114). Institute for Microelectronics, TU Wien. http://hdl.handle.net/20.500.12708/76645 ( reposiTUm)

Selberherr, S., & Filipovic, L. (2019). CMOS Compatible Gas Sensors. In Book of Abstracts of the International Conference on Materials Science and Engineering (p. 1). http://hdl.handle.net/20.500.12708/76564 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2018). Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries. In F. Gamiz, V. Sverdlov, C. Sampedro, & L. Donetti (Eds.), 2018 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS). IEEE. https://doi.org/10.1109/ulis.2018.8354763 ( reposiTUm)

Filipovic, L., & de Orio, R. L. (2018). Modeling the Influence of Grains and Material Interfaces on Electromigration. In 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2018 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Austin, TX, United States of America (the). IEEE. https://doi.org/10.1109/sispad.2018.8551746 ( reposiTUm)

Lahlalia, A., Neel, O. L., Shankar, R., Selberherr, S., & Filipovic, L. (2018). Enhanced Sensing Performance of Integrated Gas Sensor Devices. In EUROSENSORS 2018. EUROSENSORS, Dresden, Germany. https://doi.org/10.3390/proceedings2131508 ( reposiTUm)

Klemenschits, X., Selberherr, S., & Filipovic, L. (2018). Unified Feature Scale Model for Etching in SF6 and Cl Plasma Chemistries. In Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) (pp. 65–66). http://hdl.handle.net/20.500.12708/76169 ( reposiTUm)

Filipovic, L., Lahlalia, A., & Selberherr, S. (2018). System-on-Chip Sensor Integration in Advanced CMOS Technology. In Proceedings of the 233#^{rd} ECS Meeting (ECS). 233#^{rd} ECS Meeting (ECS), Seattle, United States of America (the). http://hdl.handle.net/20.500.12708/76162 ( reposiTUm)

Filipovic, L. (2018). CMOS-Compatible Semiconductor-Based Gas Sensors. In Book of Abstracts of Emerging Technologies Communication Microsystems Optoelectronics Sensors. Emerging Technologies Communication Microsystems Optoelectronics Sensing (ETCMOS), Montreal, Canada. http://hdl.handle.net/20.500.12708/76165 ( reposiTUm)

Filipovic, L., de Orio, R. L., Zisser, W. H., & Selberherr, S. (2017). Modeling electromigration in nanoscaled copper interconnects. In 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2017 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Kamakura, Japan. IEEE. https://doi.org/10.23919/sispad.2017.8085289 ( reposiTUm)

Cervenka, J., & Filipovic, L. (2017). Numerical Aspects of the Deterministic Solution of the Wigner Equation. In Book of Abstracts of the International Wigner Workshop (IW2) (pp. 42–43). Institute for Microelectronics, TU Wien. http://hdl.handle.net/20.500.12708/75676 ( reposiTUm)

Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., & Selberherr, S. (2016). Using One-Dimensional Radiosity to Model Neutral Particle Flux in High Aspect Ratio Holes. In V. Sverdlov & S. Selberherr (Eds.), 2016 Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS). IEEE. https://doi.org/10.1109/ulis.2016.7440067 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2016). Modeling the Deposition and Stress Generation in Thin Films for CMOS-Integrated Gas Sensors. In Proceedings of the BIT’s 2nd Annual World Congress of Smart Materials 2016 (p. 517). http://hdl.handle.net/20.500.12708/75088 ( reposiTUm)

Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., & Selberherr, S. (2016). Using one-dimensional radiosity to model neutral flux in convex high aspect ratio structures. In 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2016 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Nuremberg, Germany. IEEE. https://doi.org/10.1109/sispad.2016.7605198 ( reposiTUm)

Manstetten, P., Filipovic, L., Hössinger, A., Weinbub, J., & Selberherr, S. (2016). Modeling Neutral Particle Flux in High Aspect Ratio Holes using a One-Dimensional Radiosity Approach. In Book of Abstracts of the Joint International EUROSOI Workshop and International Conference on Ultimate Integration on Silicon (EUROSOI-ULIS) (pp. 68–69). http://hdl.handle.net/20.500.12708/75065 ( reposiTUm)

Filipovic, L., Singulani, A. P., Roger, F., Carniello, S., & Selberherr, S. (2016). Impact of across-wafer variation on the electrical performance of TSVs. In 2016 IEEE International Interconnect Technology Conference / Advanced Metallization Conference (IITC/AMC). IEEE International Interconnect Technology Conference (IITC), San Jose, United States of America (the). https://doi.org/10.1109/iitc-amc.2016.7507707 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2016). Effects of the Deposition Process Variation on the Performance of Open TSVs. In 2016 IEEE 66th Electronic Components and Technology Conference (ECTC). IEEE Electronic Components and Technology Conference (ECTC), Las Vegas, United States of America (the). https://doi.org/10.1109/ectc.2016.177 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2015). Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors. In Proceedings of the 227th ECS Meeting (ECS) (p. 2). ECS Transactions. http://hdl.handle.net/20.500.12708/74559 ( reposiTUm)

Filipovic, L., Singulani, A. P., Roger, F., Carniello, S., & Selberherr, S. (2015). Intrinsic Stress Analysis of Tungsten-Lined Open TSVs. In Abstracts of the 26#^{th} European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (p. 71). http://hdl.handle.net/20.500.12708/74745 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2015). Stress in Three-Dimensionally Integrated Sensor Systems. In Abstracts of the 2015 International Conference on Materials for Advanced Technologies (ICMAT) (p. 342). http://hdl.handle.net/20.500.12708/75036 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2015). Processing of integrated gas sensor devices. In TENCON 2015 - 2015 IEEE Region 10 Conference. IEEE International Technical Conference of IEEE Region 10 (TENCON), Macau, China. https://doi.org/10.1109/tencon.2015.7372781 ( reposiTUm)

Roger, F., Singulani, A., Carniello, S., Filipovic, L., & Selberherr, S. (2015). Global statistical methodology for the analysis of equipment parameter effects on TSV formation. In 2015 International Workshop on CMOS Variability (VARI). International Workshop on CMOS Variability (VARI), Salvador, Brazil. https://doi.org/10.1109/vari.2015.7456561 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2015). Kinetics of Droplet Motion During Spray Pyrolysis. In Abstracts of the Energy-Materials-Nanotechnology Meeting on Droplets (EMN) (pp. 127–128). http://hdl.handle.net/20.500.12708/74549 ( reposiTUm)

Filipovic, L., Orio, R., & Selberherr, S. (2014). Process and Performance of Copper TSVs. In Conference Proceedings of the Tenth Workshop of the Thematic Network on Silicon on Insulator Technology, Devices and Circuits (pp. 1–2). http://hdl.handle.net/20.500.12708/73995 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2014). Spray pyrolysis deposition for gas sensor integration in the backend of standard CMOS processes. In 2014 12th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT). International Conference on Solid State and Integrated Circuit Technology (ICSICT), Peking, Austria. https://doi.org/10.1109/icsict.2014.7021507 ( reposiTUm)

Filipovic, L., Rudolf, F., Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Singulani, A., Minixhofer, R., & Selberherr, S. (2014). Three-dimensional simulation for the reliability and electrical performance of through-silicon vias. In 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2014 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Yokohama, Japan. IEEE. https://doi.org/10.1109/sispad.2014.6931633 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2014). The Effects of Etching and Deposition on the Performance and Stress Evolution of Open Through Silicon Vias. In Abstracts 25th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis (ESREF) (p. 36). http://hdl.handle.net/20.500.12708/74177 ( reposiTUm)

Filipovic, L., de Orio, R. L., & Selberherr, S. (2014). Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs. In 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ghent, Belgium, EU. https://doi.org/10.1109/eurosime.2014.6813768 ( reposiTUm)

Filipovic, L., de Orio, R. L., Selberherr, S., Singulani, A., Roger, F., & Minixhofer, R. (2014). Effects of sidewall scallops on open tungsten TSVs. In 2014 IEEE International Reliability Physics Symposium. International Reliability Physics Symposium (IRPS), Phoenix, Non-EU. https://doi.org/10.1109/irps.2014.6860633 ( reposiTUm)

Filipovic, L., de Orio, R. L., & Selberherr, S. (2014). Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs. In Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA). IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), Singapore, Non-EU. https://doi.org/10.1109/ipfa.2014.6898137 ( reposiTUm)

Baer, E., Evanschitzky, P., Lorenz, J., Roger, F., Minixhofer, R., Filipovic, L., Orio, R., & Selberherr, S. (2014). Coupled Simulation to Determine Across Wafer Variations for Electrical and Reliability Parameters of Through-Silicon VIAs. In Book of Abstracts (p. 2). http://hdl.handle.net/20.500.12708/74007 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2014). Stress Considerations for System-on-Chip Gas Sensor Integration in CMOS Technology. In Abstracts of 13th International Workshop on Stress-Induced Phenomena in Microelectronics (p. 41). http://hdl.handle.net/20.500.12708/74263 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2014). About Processes and Performance of Integrated Gas Sensor Components. In Abstracts of the Energy-Materials-Nanotechnology Fall Meeting (EMN) (pp. 96–97). http://hdl.handle.net/20.500.12708/74262 ( reposiTUm)

Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., & Grogger, W. (2013). Modeling the growth of thin SnO2 films using spray pyrolysis deposition. In 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD). 2013 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Glasgow, United Kingdom of Great Britain and Northern Ireland (the). IEEE. https://doi.org/10.1109/sispad.2013.6650611 ( reposiTUm)

Singulani, A. P., Ceric, H., Filipovic, L., & Langer, E. (2013). Impact of bosch scallops dimensions on stress of an open through Silicon Via technology. In 2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE). International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Poland, Non-EU. https://doi.org/10.1109/eurosime.2013.6529938 ( reposiTUm)

Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., & Schrank, F. (2013). Modeling Spray Pyrolysis Deposition. In Proceedings of the World Congress on Engineering (WCE) Vol II (pp. 987–992). http://hdl.handle.net/20.500.12708/73529 ( reposiTUm)

Weinbub, J., Rupp, K., Filipovic, L., Makarov, A., & Selberherr, S. (2012). Towards a Free Open Source Process and Device Simulation Framework. In Book of Abstracts of the International Workshop on Computational Electronics (IWCE) (pp. 141–142). http://hdl.handle.net/20.500.12708/72828 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2012). Electric Field Based Simulations of Local Oxidation Nanolithography Using Atomic Force Microscopy in a Level Set Environment. In ECS Transactions (pp. 265–272). 49. https://doi.org/10.1149/04901.0265ecst ( reposiTUm)

Filipovic, L., & Selberherr, S. (2012). Simulations of Local Oxidation Nanolithography by AFM Based on the Generated Electric Field. In 2012 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) (pp. 189–192). http://hdl.handle.net/20.500.12708/72951 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2012). Simulation of Silicon Nanopatterning Using nc-AFM. In Abstracts 15th International Conference on non-contact Atomic Force Microscopy (nc-AFM) (p. 108). http://hdl.handle.net/20.500.12708/72871 ( reposiTUm)

Weinbub, J., Rupp, K., Filipovic, L., Makarov, A., & Selberherr, S. (2012). Towards a Free Open Source Process and Device Simulation Framework. In 2012 15th International Workshop on Computational Electronics. IEEE Xplore. https://doi.org/10.1109/iwce.2012.6242867 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2012). A Monte Carlo Simulator for Non-contact Mode Atomic Force Microscopy. In I. Lirkov, S. Margenov, & J. Waśniewski (Eds.), Large-Scale Scientific Computing: 8th International Conference, LSSC 2011 (pp. 447–454). Springer Berlin Heidelberg. https://doi.org/10.1007/978-3-642-29843-1_50 ( reposiTUm)

Filipovic, L., Ertl, O., & Selberherr, S. (2011). Parallelization Strategy for Hierarchical Run Length Encoded Data Structures. In Proceedings of the IASTED International Conference on Parallel and Distributed Computing and Networks (PDCN 2011) (pp. 131–138). http://hdl.handle.net/20.500.12708/72059 ( reposiTUm)

Filipovic, L., Ceric, H., Cervenka, J., & Selberherr, S. (2011). A simulator for local anodic oxidation of silicon surfaces. In 2011 24th Canadian Conference on Electrical and Computer Engineering(CCECE). IEEE Canadian Conference on Electrical and Computer Engineering (CCECE), Saskatoon, SK, Canada, Non-EU. https://doi.org/10.1109/ccece.2011.6030543 ( reposiTUm)

Filipovic, L., Nedjalkov, M., & Selberherr, S. (2011). A Monte Carlo Simulator for Non-Contact Atomic Force Microscopy. In Abstracts Intl. Conf. on Large-Scale Scientific Computations (pp. 42–43). http://hdl.handle.net/20.500.12708/72143 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2011). A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator. In Abstracts IMACS Seminar on Monte Carlo Methods (MCM) (p. 30). http://hdl.handle.net/20.500.12708/72254 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2011). A Level Set simulator for nanooxidation using non-contact atomic force microscopy. In 2011 International Conference on Simulation of Semiconductor Processes and Devices. 2011 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Osaka, Japan. IEEE. https://doi.org/10.1109/sispad.2011.6035031 ( reposiTUm)

Ertl, O., Filipovic, L., & Selberherr, S. (2010). Three-dimensional simulation of focused ion beam processing using the level set method. In 2010 International Conference on Simulation of Semiconductor Processes and Devices. 2010 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Bologna, Italy. IEEE. https://doi.org/10.1109/sispad.2010.5604573 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2021). Electro-Thermo-Mechanical Simulation of Semiconductor Metal Oxide Gas Sensors. In M. I. Khan (Ed.), Prime Archives in Material Science (pp. 1–38). Vide Leaf. http://hdl.handle.net/20.500.12708/30562 ( reposiTUm)

Coppeta, R., Lahlalia, A., Kozic, D., Hammer, R., Riedler, J., Toschkoff, G., Singulani, A., Ali, Z., Sagmeister, M., Carniello, S., Selberherr, S., & Filipovic, L. (2020). Electro-Thermal-Mechanical Modeling of Gas Sensor Hotplates. In W. D. van Driel, O. Pyper, & C. Schumann (Eds.), Sensor Systems Simulations (pp. 17–72). Springer International Publishing. https://doi.org/10.1007/978-3-030-16577-2_2 ( reposiTUm)

Gnam, L., Manstetten, P., Hössinger, A., Selberherr, S., & Weinbub, J. (2019). Accelerating Flux Calculations Using Sparse Sampling. In L. Filipovic & T. Grasser (Eds.), Miniaturized Transistors (pp. 176–192). MDPI. https://doi.org/10.3390/mi9110550 ( reposiTUm)

Filipovic, L., & Lahlalia, A. (2018). (Invited)<i />System-on-Chip Sensor Integration in Advanced CMOS Technology. In J. A. Martino, J.-P. Raskin, S. Selberherr, H. Ishii, F. Gamiz, B.-Y. Nguyen, & A. Yoshino (Eds.), ECS Transactions (pp. 151–162). ECS Transactions. https://doi.org/10.1149/08508.0151ecst ( reposiTUm)

Filipovic, L., & Selberherr, S. (2015). Stress Considerations in Thin Films for CMOS-Integrated Gas Sensors. In Y. Omura, J. A. Martino, J.-P. Raskin, S. Selberherr, H. Ishii, F. Gamiz, & B.-Y. Nguyen (Eds.), ECS Transactions (pp. 243–250). ECS Transactions. https://doi.org/10.1149/06605.0243ecst ( reposiTUm)

Filipovic, L., Selberherr, S., Mutinati, G. C., Brunet, E., Steinhauer, S., Köck, A., Teva, J., Kraft, J., Siegert, J., Schrank, F., Gspan, C., & Grogger, W. (2014). Modeling and Analysis of Spray Pyrolysis Deposited SnO2 Films for Gas Sensors. In G.-C. Yang, S.-L. Ao, & L. Gelman (Eds.), Transactions on Engineering Technologies (pp. 295–310). Springer. https://doi.org/10.1007/978-94-017-8832-8_22 ( reposiTUm)

Filipovic, L., & Selberherr, S. (2012). Chapter 11. A Two-Dimensional Lorentzian Distribution for an Atomic Force Microscopy Simulator. In K. K. Sabelfeld & I. Dimov (Eds.), Monte Carlo Methods and Applications (pp. 97–104). De Gruyter. https://doi.org/10.1515/9783110293586.97 ( reposiTUm)

Filipovic, L., & Grasser, T. (Eds.). (2022). Miniaturized Transistors, Volume II. MDPI. https://doi.org/10.3390/books978-3-0365-4170-9 ( reposiTUm)

Filipovic, L., & Grasser, T. (Eds.). (2019). Miniaturized Transistors. MDPI. https://doi.org/10.3390/books978-3-03921-011-4 ( reposiTUm)

Filipovic, L. (2022). A Broadly-Applicable Ensemble Monte Carlo Framework. Workshop Monte Carlo Simulation: Beyond Moore’s Law, 2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), Granada, Spain. http://hdl.handle.net/20.500.12708/153519 ( reposiTUm)

Filipovic, L. (2022, September 5). ViennaEMC: A Broadly-Applicable Ensemble Monte Carlo Framework [Conference Presentation]. Workshop WS1 - Monte Carlo Simulation: Beyond Moore’s LAW 2022, Granada, Spain. ( reposiTUm)

Filipovic, L., Kampl, M., Knobloch, T., Rzepa, G., & Weinbub, J. (2018). Ihr Smartphone - Ein Supercomputer vor 20 Jahren. Ein Einblick in die Mikro- und Nanoelektronik (mit Virtual Reality). Lange Nacht der Forschung 2018, Wien, Austria. http://hdl.handle.net/20.500.12708/91096 ( reposiTUm)

Ullmann, B., Grill, A., Manstetten, P., Jech, M., Kampl, M., Zisser, W., Filipovic, L., Thesberg, M., Rudolf, F., Windbacher, T., Cervenka, J., Katterbauer, M., & Weinbub, J. (2016). Ihr Smartphone - ein Supercomputer vor 20 Jahren. Ein Einblick in die Mikro- und Nanoelektronik. Lange Nacht der Forschung 2016, Wien, Austria. http://hdl.handle.net/20.500.12708/90775 ( reposiTUm)

Filipovic, L. (2019). Semiconductor based integrated sensors [Professorial Dissertation, Technische Universität Wien]. reposiTUm. http://hdl.handle.net/20.500.12708/159461 ( reposiTUm)