Hartleb, M., Imrich, P., Zechner, J., Walter, T., Petersmann, M., & Khatibi Damavandi, G. (2024). Adhesion properties of polyimide coated stacks: An in-depth analysis of the cross-sectional nanoindentation method. Heliyon, 10(24), Article e40967. https://doi.org/10.1016/j.heliyon.2024.e40967 ( reposiTUm)

Felke, F., Groth, A., Hempel, M., Czerny, B., Khatibi Damavandi, G., Döhler, T., & Geißler, U. (2024). Effect of the loop forming process on the lifetime of aluminum heavy wire bonds under accelerated mechanical testing. Microelectronics Reliability, 154, Article 115337. https://doi.org/10.1016/j.microrel.2024.115337 ( reposiTUm)

Khodabakhshi, F., Wodak, I., Yakymovych, A., Taheriniya, S., Khademorezaian, S., Wilde, G., & Khatibi Damavandi, G. (2024). Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints. Materials Characterization, 216, Article 114247. https://doi.org/10.1016/j.matchar.2024.114247 ( reposiTUm)

Lederer, M., Betzwar Kotas, A. M., & Khatibi, G. (2023). Lifetime modeling of solder joints based on accelerated mechanical testing and Finite Element Analysis. Power Electronic Devices and Components, 4, 100034. https://doi.org/10.1016/j.pedc.2023.100034 ( reposiTUm)

Walter, T., Khatibi, G., Betzwar Kotas, A., & Kretschy, N. (2023). In-situ delamination detection in multi-layered semiconductor packages. Microelectronics Reliability, 150, Article 115098. https://doi.org/10.1016/j.microrel.2023.115098 ( reposiTUm)

Wodak, I., Yakymovych, A., Svec, P., Orovcik, L., & Khatibi, G. (2023). Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints. Applied Nanoscience, 13(11), 7379–7385. https://doi.org/10.1007/s13204-023-02912-4 ( reposiTUm)

Zareghomsheh, M., & Khatibi, G. (2022). The Activation Energy of Strain Bursts during Nanoindentation Creep on Polyethylene. Materials, 16(1), Article 143. https://doi.org/10.3390/ma16010143 ( reposiTUm)

Czerny, B., & Khatibi Damavandi, G. (2022). Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics. Journal of Microelectronics and Electronic Packaging, 19, 49–55. https://doi.org/10.4071/imaps.1717134 ( reposiTUm)

Rafiee, P., Khatibi, G., & Solazzi, F. (2022). Optically-detected nonlinear oscillations of single crystal silicon MEMS accelerometers. Microelectronics International, 33(2), 107–115. https://doi.org/10.1108/MI-04-2015-0042 ( reposiTUm)

Fernández-Canteli, A., Castillo, E., Blasón, S., Khatibi Damavandi, G., Czerny, B., & Zareghomsheh, M. (2022). Un modelo integral para describir la influencia de la frecuencia de ensayo sobre los resultados de fatiga. Revista española de mecánica de la fractura, 83–88. http://hdl.handle.net/20.500.12708/175772 ( reposiTUm)

Walter, T., Zareghomsheh, M., Khatibi Damavandi, G., Popok, V., Kristensen, P. K., Boturchuk, I., & Schwarz, S. (2022). Interfacial adhesion strength of III-N heterostructures. Materials & Design, 213, 1–12. https://doi.org/10.1016/j.matdes.2021.110319 ( reposiTUm)

Lederer, M., Walter, T., & Khatibi, G. (2021). Modelling of Cyclic Delamination Behavior of Thin Multilayered Structures Using Gradient Elasticity and Damage Accumulation. Materials Science Forum, 1016, 857–862. https://doi.org/10.4028/www.scientific.net/MSF.1016.857 ( reposiTUm)

Lederer, M., Gökdeniz, Z. G., Khatibi Damavandi, G., & Nicolics, J. (2021). Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packages. Microelectronics Reliability, 126, 1–7. https://doi.org/10.1016/j.microrel.2021.114209 ( reposiTUm)

Lederer, M., Betzwar Kotas, A. M., & Khatibi Damavandi, G. (2020). A lifetime assessment and prediction method for large area solder joints. Microelectronics Reliability, 114, 1–7. https://doi.org/10.1016/j.microrel.2020.113888 ( reposiTUm)

Czerny, B., & Khatibi Damavandi, G. (2020). Interface characterization of Cu Cu ball bonds by a fast shear fatigue method. Microelectronics Reliability, 114, 1–9. https://doi.org/10.1016/j.microrel.2020.113831 ( reposiTUm)

Wodak, I., Khatibi, G., Yakymovych, A., Krammer, O., & Géczy, A. (2024). Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux Viscosity. In 2024 47th International Spring Seminar on Electronics Technology (ISSE). 2024 47th International Spring Seminar on Electronics Technology (ISSE), Czechia. https://doi.org/10.1109/ISSE61612.2024.10604161 ( reposiTUm)

Wodak, I., Géczy, A., Krammer, O., Khatibi, G., Yakymovych, A., Khodabakhshi, F., & Tafferner, Z. (2024). Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating. In 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)ME) (pp. 370–373). https://doi.org/10.1109/SIITME63973.2024.10814758 ( reposiTUm)

Walter, T., Czerny, B., & Khatibi Damavandi, G. (2024). A rapid reliability assessment method for fine wire bonds in power electronic packages. In 2024 Austrochip Workshop on Microelectronics (Austrochip). 2024 Austrochip Workshop on Microelectronics (Austrochip), Austria. https://doi.org/10.1109/AUSTROCHIP62761.2024.10716214 ( reposiTUm)

Hartleb, M., Imrich, P., Zechner, J., Walter, T., & Khatibi, G. (2024). Adhesion measurements of Polyimide to silicon nitride for semiconductor component applications. In 2024 47th International Spring Seminar on Electronics Technology (ISSE). 2024 47th International Spring Seminar on Electronics Technology (ISSE), Prag, Czechia. https://doi.org/10.1109/ISSE61612.2024.10603751 ( reposiTUm)

Yakymovych, A., Wodak, I., & Khatibi Damavandi, G. (2024). Iron nanoparticle-doped flux: temperature-dependent density and viscosity of nanofluid with minor additions of Fe nanoparticles. In Nanotechnology Abstract Book International research and Practice conference: Nanotechnology and Nanomaterials - Nano2024 (pp. 87–87). ( reposiTUm)

Wodak, I., Khodabakhshi, F., Yakymovych, A., & Khatibi Damavandi, G. (2024). Interfacial reactions and microstructural evolution of Sn-based solder joints prepared with reactive Fe nanoparticles. In IEEE Nano 2024 - Book of Abstracts (pp. 358–358). ( reposiTUm)

Yakymovych, A., Wodak, I., Khodabakhshi, F., Flandorfer, H., Fischer, L., & Khatibi Damavandi, G. (2024). Hybrid solder joints: Thermodynamic and Calorimetric Studies of the Sn-based Fe-Sn(SAC305) alloys. In 11th International Conference on High Temperature Capillarity: Book of Abstracts (pp. 36–36). http://hdl.handle.net/20.500.12708/211248 ( reposiTUm)

Delshadmanesh, M., Lederer, M., Frank, J., & Khatibi Damavandi, G. (2023). Study of fatigue life and fatigue notch sensitivity of biocompatible Co-Cr alloy  L605. In Z. Bozic, S. Schmauder, M. Vrdoljak, & M. Andric (Eds.), International Conference on Structural Integrity and Durability 2023 : Book of Abstracts (pp. 25–25). University of Zagreb. ( reposiTUm)

Wodak, I., Yakymovych, A., & Khatibi, G. (2023). Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux. In 2023 46th International Spring Seminar on Electronics Technology (ISSE) (pp. 1–4). IEEE. https://doi.org/10.1109/ISSE57496.2023.10168365 ( reposiTUm)

Yakymovych, A., Goh, Y., Kamaruzzaman L.S., Wodak, I., & Khatibi Damavandi, G. (2023). Hybrid solder joints: Effects of Fe nanoparticle-doped flux on morphology and hardness of SAC305 solder joints. In International research and practice conference “Nanotechnology and Nanomaterials”: Book of Abstract (pp. 84–84). http://hdl.handle.net/20.500.12708/192998 ( reposiTUm)

Wodak, I., Yakymovych, A., & Khatibi Damavandi, G. (2023). Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped Flux. In B. Mihailescu, C. Marghescu, & H. Wohlrabe (Eds.), ISSE 2023 - 46th International Spring Seminar on Electronics Technology “Revolutionizing the Electronic Ecosystems - Chiplet and Heterogeneous Inegration” (pp. 148–149). Editura Politehnica. ( reposiTUm)

Wodak, I., Khodabakhshi, F., Yakymovych, A., & Khatibi Damavandi, G. (2023). Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*. In Institute of Electrical and Electronics Engineers Inc. (Ed.), 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) (pp. 711–716). https://doi.org/10.1109/NMDC57951.2023.10343630 ( reposiTUm)

Walter, T., & Khatibi Damavandi, G. (2023). In-situ Delaminationsmessung in Mehrlagenstrukturen der Elektronik. In H. Gremmel-Simon (Ed.), Energie und Klimawandel : Energie - Gebäude - Umwelt : e-nova, international conference, 14. und 15. Juni 2023, Band 26 (pp. 207–214). Holzhausen. http://hdl.handle.net/20.500.12708/191276 ( reposiTUm)

Hartleb, M., Imrich, P., Zechner, J., Walter, T., & Khatibi Damavandi, G. (2023). Cross-sectional Nanoindentation: Applicability for testing Polyimide adhesion in semiconductor components. In 2023 46th International Spring Seminar on Electronics Technology (ISSE) (pp. 1–5). IEEE. https://doi.org/10.1109/ISSE57496.2023.10168521 ( reposiTUm)

Czerny, B., & Khatibi Damavandi, G. (2022). Highly accelerated lifetime testing in power electronics. In IMAPS 2021 - 54th International Symposium on Microelectronics. IMAPS 2021 54th International Symposium on Microelectronics, San Diego, Austria. https://doi.org/10.4071/1085-8024-2021.1.000390 ( reposiTUm)

Lederer, M., Gökdeniz, Z. G., Khatibi Damavandi, G., & Nicolics, J. (2022). Temperaturabhängigkeit mechanischer Eigenschaften von Niedertemperatur-Silber-Sinterschichten und deren Modellierung für die Nutzung in FiniteElemente-Simulationen. In EBL DVS Berichtband 375 (pp. 244–251). ( reposiTUm)

Wodak, I., Yakymovych, A., & Khatibi Damavandi, G. (2022). Insight into synthesis of nanosized Ni and Fe particles by chemical reduction method. In Abstract Book International research and practice conference: Nanotechnology and nanomerials (NANO-2022) (p. 119). ( reposiTUm)

Wodak, I., Yakymovych, A., Strutz, P., Wimmer, C., Syrym, Y., & Khatibi Damavandi, G. (2022). Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints. In Nanotechnology Abstract Book International research and Practice conference: Nanotechnology and Nanomaterials - Nano2022. NANO-2022 - International research and practice conference “Nanotechnology and Nanomaterials,” Lviv, Ukraine, Ukraine. http://hdl.handle.net/20.500.12708/152246 ( reposiTUm)

Lederer, M., & Khatibi Damavandi, G. (2024, October 3). Overview on Fracture Mechanics Topics [Presentation]. ESIS Austria Meeting, Leoben, Austria. http://hdl.handle.net/20.500.12708/210581 ( reposiTUm)

Khatibi Damavandi, G. (2024, May 23). Innovative testing techniques for bond-wire fatigue in power electronic components [Conference Presentation]. European Test Symposium: ETS24, Netherlands (the). http://hdl.handle.net/20.500.12708/211010 ( reposiTUm)

Khodabakhshi, F., Wodak, I., Yakymovych, A., Wilde, G., & Khatibi Damavandi, G. (2024, March 19). Interaction of reactive Fe-nanoparticles with the intermetallic compounds (IMC) layer during reflow soldering solidification [Poster Presentation]. 87. Jahrestagung der DPG und DPG-Frühjahrstagung, Berlin, Germany. http://hdl.handle.net/20.500.12708/210406 ( reposiTUm)

Khodabakhshi, F., Kampel, I., Yakymovych, A., Wilde, G., & Khatibi Damavandi, G. (2024). Atom probe tomography (APT) characterization of intermetallic compounds (IMC) layer after soldering [Conference Presentation]. Material Science and Engineering MSE 2024, Darmstadt, Germany. http://hdl.handle.net/20.500.12708/210420 ( reposiTUm)

Wodak, I., Khatibi Damavandi, G., & Yakymovych, A. (2023, October). Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticles [Conference Presentation]. Materials Science and Technology (MS&T) 2023, Columbus, Ohio, United States of America (the). ( reposiTUm)

Khatibi Damavandi, G., Czerny, B., & Walter, T. (2023, April 18). Alternative POF-Based Accelerated Testing [Keynote Presentation]. Ceramic Interconnect and Ceramic Microsystems Technologies (CICMT) 2023, Albuquerque, United States of America (the). ( reposiTUm)

Khodabakhshi, F., & Khatibi Damavandi, G. (2023, September 7). Graphene and carbon nanotubes functionality in Sn-Ag-Cu solder alloy [Conference Presentation]. FEMS Euromat 23, Frankfurt am Main, Germany. ( reposiTUm)

Wodak, I., Yakymovych, A., Khodabakhshi, F., & Khatibi Damavandi, G. (2023, October 25). Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped Flux [Conference Presentation]. IEEE Nanotechnology Materials and Devices Conference (NMDC) 2023, Salerno, Italy. ( reposiTUm)

Wodak, I., Yakymovych, A., & Khatibi Damavandi, G. (2022, May 4). Insights into synthesis of nanosized Ni and Fe particles by chemical reduction method [Poster Presentation]. Nanotechnology and Nanomaterials (NANO-2022), Ukraine. ( reposiTUm)

Khatibi Damavandi, G. (2022, May 26). Reliability Assessment of Thin Films and Multilayers in Electronic Packages [Conference Presentation]. 48th International Conference on Metallurgical Coatings and Thin Films, ICMCTF, San Diego, CA, United States of America (the). http://hdl.handle.net/20.500.12708/153150 ( reposiTUm)

Betzwar Kotas, A. M., Lederer, M., Khatibi Damavandi, G., Boczkal, G., & Perek-Nowak M. (2022). Mechanical Reliability of Lead-Free Solder Joints: Comparative Study of Sn3.5Ag versus SnSbAg Solder Alloy [Poster Presentation]. ISSE 2022, Austria. ( reposiTUm)

Lederer, M., Betzwar Kotas, A. M., & Khatibi Damavandi, G. (2022). Accelerated Fatigue Testing and Lifetime Modelling of Solder Interconnects in Power Electronics [Conference Presentation]. 2022 45th International Spring Seminar on Electronics Technology, Austria. ( reposiTUm)

Khatibi Damavandi, G., Czerny, B., Walter, T., Lederer, M., Betzwar Kotas, A. M., & Zareghomsheh, M. (2022, June). PoF Based Accelerated Testing [Presentation]. CAM-Workshop 2022, Germany. ( reposiTUm)

Khatibi Damavandi, G., & Czerny, B. (2022). Mechanical lifetime testing of wire bonds vs power cycling [Conference Presentation]. International Workshop on integrated power packaging 2022, France. ( reposiTUm)

Wodak, I., Yakymovych, A., Strutz P., Wimmer C., Yerbol S., & Khatibi Damavandi, G. (2022, May 4). Hybrid solder joints: the effect of nano-sized Ni and ceramic admixtures on morphology and shear strength of Sn-5.0Ag solder joints [Poster Presentation]. Nanotechnology and Nanomaterials (NANO-2022), Ukraine. ( reposiTUm)

Khatibi Damavandi, G., & Walter, T. (2023, September). Beschleunigte Prüfmethode für Lotverbindungen in der Elektronik. PLUS - Produktion von Leiterplatten und Systemen, 9, 1158–1170. http://hdl.handle.net/20.500.12708/190351 ( reposiTUm)

Khatibi Damavandi, G., & Czerny, B. (2023, October). Lebensdauerprognose von IGBT-Modulen in Rekordzeit mit BAMFIT-Bondtester. PLUS - Produktion von Leiterplatten und Systemen, 10/2023, 1311–1320. http://hdl.handle.net/20.500.12708/190363 ( reposiTUm)