Khodabakhshi, F., Wodak, I., Yakymovych, A., Taheriniya, S., Khademorezaian, S., Wilde, G., & Khatibi Damavandi, G. (2024). Nano-scale mechanistic model for microstructural reliability in reactive hybrid solder joints. Materials Characterization, 216, Article 114247. https://doi.org/10.1016/j.matchar.2024.114247 ( reposiTUm)

Wodak, I., Yakymovych, A., Svec, P., Orovcik, L., & Khatibi, G. (2023). Hybrid solder joints: the effect of nanosized ZrO₂ particles on morphology of as-reflowed and thermally aged Sn-3.5Ag solder joints. Applied Nanoscience, 13(11), 7379–7385. https://doi.org/10.1007/s13204-023-02912-4 ( reposiTUm)

Yakymovych, A., & Shtablavyi, I. (2023). Effect of Nanosized Ni Reinforcements on the Structure of the Sn-3.0Ag-0.5Cu Alloy in Liquid and After-Reflow Solid States. Metals, 13(6), Article 1093. https://doi.org/10.3390/met13061093 ( reposiTUm)

Plevachuk, Y., Švec, P. S., Švec, P., Orovcik, L., Bajana, O., Yakymovych, A., & Rud, A. (2023). Metal deposited nanoparticles as “bridge materials” for lead-free solder nanocomposites. Applied Nanoscience, 13(12), 7387–7397. https://doi.org/10.1007/s13204-023-02898-z ( reposiTUm)

Wodak, I., Khatibi, G., Yakymovych, A., Krammer, O., & Géczy, A. (2024). Iron Nanoparticle-Doped Flux: Wetting Characteristics of Flux and SAC305 Solder and Effects on Flux Viscosity. In 2024 47th International Spring Seminar on Electronics Technology (ISSE). 2024 47th International Spring Seminar on Electronics Technology (ISSE), Czechia. https://doi.org/10.1109/ISSE61612.2024.10604161 ( reposiTUm)

Wodak, I., Géczy, A., Krammer, O., Khatibi, G., Yakymovych, A., Khodabakhshi, F., & Tafferner, Z. (2024). Impact of Fe-NPs doped flux on electromigration in Sn-based solder joints of chip-sized SMD components at lower Joule heating. In 2024 IEEE 30th International Symposium for Design and Technology in Electronic Packaging (SIITME)ME) (pp. 370–373). https://doi.org/10.1109/SIITME63973.2024.10814758 ( reposiTUm)

Yakymovych, A., Wodak, I., & Khatibi Damavandi, G. (2024). Iron nanoparticle-doped flux: temperature-dependent density and viscosity of nanofluid with minor additions of Fe nanoparticles. In Nanotechnology Abstract Book International research and Practice conference: Nanotechnology and Nanomaterials - Nano2024 (pp. 87–87). ( reposiTUm)

Wodak, I., Khodabakhshi, F., Yakymovych, A., & Khatibi Damavandi, G. (2024). Interfacial reactions and microstructural evolution of Sn-based solder joints prepared with reactive Fe nanoparticles. In IEEE Nano 2024 - Book of Abstracts (pp. 358–358). ( reposiTUm)

Yakymovych, A., Wodak, I., Khodabakhshi, F., Flandorfer, H., Fischer, L., & Khatibi Damavandi, G. (2024). Hybrid solder joints: Thermodynamic and Calorimetric Studies of the Sn-based Fe-Sn(SAC305) alloys. In 11th International Conference on High Temperature Capillarity: Book of Abstracts (pp. 36–36). http://hdl.handle.net/20.500.12708/211248 ( reposiTUm)

Wodak, I., Yakymovych, A., & Khatibi, G. (2023). Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-based Solders with nano-sized Fe doped Flux. In 2023 46th International Spring Seminar on Electronics Technology (ISSE) (pp. 1–4). IEEE. https://doi.org/10.1109/ISSE57496.2023.10168365 ( reposiTUm)

Yakymovych, A., Goh, Y., Kamaruzzaman L.S., Wodak, I., & Khatibi Damavandi, G. (2023). Hybrid solder joints: Effects of Fe nanoparticle-doped flux on morphology and hardness of SAC305 solder joints. In International research and practice conference “Nanotechnology and Nanomaterials”: Book of Abstract (pp. 84–84). http://hdl.handle.net/20.500.12708/192998 ( reposiTUm)

Wodak, I., Yakymovych, A., & Khatibi Damavandi, G. (2023). Hybrid Solder Joints: Morphology and Mechanical Properties of lead-free Sn-3.0Ag-0.5Cu Solders prepared with Fe-NPs doped Flux. In B. Mihailescu, C. Marghescu, & H. Wohlrabe (Eds.), ISSE 2023 - 46th International Spring Seminar on Electronics Technology “Revolutionizing the Electronic Ecosystems - Chiplet and Heterogeneous Inegration” (pp. 148–149). Editura Politehnica. ( reposiTUm)

Wodak, I., Khodabakhshi, F., Yakymovych, A., & Khatibi Damavandi, G. (2023). Microstructural Features and Crystallographic Texture of Sn3.5Ag Solder Joints Produced with Fe-Nanoparticle Doped Flux*. In Institute of Electrical and Electronics Engineers Inc. (Ed.), 2023 IEEE Nanotechnology Materials and Devices Conference (NMDC) (pp. 711–716). https://doi.org/10.1109/NMDC57951.2023.10343630 ( reposiTUm)

Khodabakhshi, F., Kampel, I., Yakymovych, A., Wilde, G., & Khatibi Damavandi, G. (2024). Atom probe tomography (APT) characterization of intermetallic compounds (IMC) layer after soldering [Conference Presentation]. Material Science and Engineering MSE 2024, Darmstadt, Germany. http://hdl.handle.net/20.500.12708/210420 ( reposiTUm)

Khodabakhshi, F., Wodak, I., Yakymovych, A., Wilde, G., & Khatibi Damavandi, G. (2024, March 19). Interaction of reactive Fe-nanoparticles with the intermetallic compounds (IMC) layer during reflow soldering solidification [Poster Presentation]. 87. Jahrestagung der DPG und DPG-Frühjahrstagung, Berlin, Germany. http://hdl.handle.net/20.500.12708/210406 ( reposiTUm)

Wodak, I., Khatibi Damavandi, G., & Yakymovych, A. (2023, October). Hybrid solder joints: Morphology and shear strength of Sn-3.5Ag solder joints with flux doped with ceramic nanoparticles [Conference Presentation]. Materials Science and Technology (MS&T) 2023, Columbus, Ohio, United States of America (the). ( reposiTUm)

Khodabakhshi, F., & Khatibi Damavandi, G. (2023, September 7). Graphene and carbon nanotubes functionality in Sn-Ag-Cu solder alloy [Conference Presentation]. FEMS Euromat 23, Frankfurt am Main, Germany. ( reposiTUm)

Wodak, I., Yakymovych, A., Khodabakhshi, F., & Khatibi Damavandi, G. (2023, October 25). Microstructural Features and Mechanical Properties of Sn3.5Ag Solder Joints Produced with Fe- and Ni- Nanoparticle Doped Flux [Conference Presentation]. IEEE Nanotechnology Materials and Devices Conference (NMDC) 2023, Salerno, Italy. ( reposiTUm)