2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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		Preview	Author(s)	Title	Type	Issue Date
	1		Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann	Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints	Konferenzbeitrag Inproceedings	2021

2021 23rd European Microelectronics and Packaging Conference &amp; Exhibition (EMPC)