2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann | Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints | Konferenzbeitrag Inproceedings | 2021 |