Proceedings of the 14th Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Book title Buchtitel
Proceedings of the 14th Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Publisher Herausgeber
IEEE, Piscataway, NJ
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Kravchenko, Grygoriy ; Karunamurthy, Balamurugan ; Nelhiebel, Michael ; Pettermann, Heinz E. | Finite Element Analysis of Fatigue cracks Formation in Power Metallization of a Semiconductor Device Subjected to Active Cycling | Konferenzbeitrag Inproceedings | 2013 |