Proceedings of the 7th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Book title Buchtitel
Proceedings of the 7th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Publisher Herausgeber
IEEE
Place of publishing Erscheinungsort
CFP16566-USB
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Springer, Martin ; Nelhiebel, Michael ; Pettermann, Heinz E. | Fatigue Crack Growth Modeling in the Metallization of Power Semiconductors under Cyclic Thermo-Mechanical Loading | Konferenzbeitrag Inproceedings | 2016 |