2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Book title Buchtitel
2020 21st International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Publisher Herausgeber
IEEE Xplore
Results 1-2 of 2 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Siroky, Georg ; Melinc, David ; Magnien, Julien ; Kozeschnik, Ernst ; Kieslinger, Dietmar ; Kraker, Elke ; Ecker, Werner | Healing solders: A numerical investigation of damage-healing experiments | Konferenzbeitrag Inproceedings | 2020 | |
| 2 | Hoffmann, Paul ; Nelhiebel, Michael ; Karunamurthy, Balamurugan ; Pettermann, Heinz E. ; Todt, Melanie | Simulation of Fatigue Damage in Clusters of DMOS Cells Subjected to Non-Uniform Transient Thermo-Mechnical Loading | Konferenzbeitrag Inproceedings | 2020 |