Proceedings of XXIX Intern. Conference of IMAPS Poland Chapter

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	Author(s)	Title	Type	Issue Date
1	Gschohsmann, Walter ; Smetana, Walter	FE-Analysis of Lead-Less Solder Joints with Pore Inclusion	Konferenzbeitrag Inproceedings	2005
2	Güleryüz, Deniz ; Smetana, Walter	Mass Flow Sensor Realized in LTCC-Technology	Konferenzbeitrag Inproceedings	2005
3	Smetana, Walter ; Gschohsmann, Walter	Research Activities of the "Thick-film- and Ceramic-Microstructure-Packaging laboratory" at ISAS of Vienna University of Technology	Konferenzbeitrag Inproceedings	2005