Proceedings of XXIX Intern. Conference of IMAPS Poland Chapter

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Proceedings of XXIX Intern. Conference of IMAPS Poland Chapter
 

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PreviewAuthor(s)TitleTypeIssue Date
1Gschohsmann, Walter ; Smetana, Walter FE-Analysis of Lead-Less Solder Joints with Pore InclusionKonferenzbeitrag Inproceedings2005
2Güleryüz, Deniz ; Smetana, Walter Mass Flow Sensor Realized in LTCC-TechnologyKonferenzbeitrag Inproceedings2005
3Smetana, Walter ; Gschohsmann, Walter Research Activities of the "Thick-film- and Ceramic-Microstructure-Packaging laboratory" at ISAS of Vienna University of TechnologyKonferenzbeitrag Inproceedings2005