2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Book title Buchtitel
2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Publisher Verlag
IEEE
DOI
10.1109/EuroSimE18953.2011
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