Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT 2013)
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Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT 2013)
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Preview | Authors / Editors | Title | Type | Issue Date | |
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1 | Orio, Roberto ; Selberherr, Siegfried | About Voids in Copper Interconnects | Konferenzbeitrag Inproceedings | 2013 |