Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT 2013)

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Proceedings of the International Conference on Materials for Advanced Technologies (ICMAT 2013)
 

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PreviewAuthors / EditorsTitleTypeIssue Date
1Orio, Roberto ; Selberherr, Siegfried About Voids in Copper InterconnectsKonferenzbeitrag Inproceedings2013