2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Filipovic, Lado ; de Orio, Roberto Lacerda ; Selberherr, Siegfried | Process and reliability of SF<inf>6</inf>/O<inf>2</inf> plasma etched copper TSVs | Konferenzbeitrag Inproceedings | 2014 |