IEEE Proceedings
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IEEE Proceedings
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Preview | Authors / Editors | Title | Type | Issue Date | |
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1 | Suhir, Ephraim ; Nicolics, Johann ; Bechou, Laurent | Aerospace Electronic and Photonic Packaging: Predicted Thermal Stresses in Bi- and Tri-Material Assemblies | Konferenzbeitrag Inproceedings | 2014 |