2018 IEEE International Electron Devices Meeting (IEDM)
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2018 IEEE International Electron Devices Meeting (IEDM)
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Franco, J. ; Wu, Z. ; Rzepa, G. ; Vandooren, A. ; Arimura, H. ; Ragnarsson, L. -A ; Hellings, G. ; Brus, S. ; Cott, D. ; De Heyn, V. ; Groeseneken, G. ; Horiguchi, N. ; Ryckaert, J. ; Collaert, N. ; Linten, D. ; Grasser, T. ; Kaczer, B. | BTI Reliability Improvement Strategies in Low Thermal Budget Gate Stacks for 3D Sequential Integration | Konferenzbeitrag Inproceedings  | 2018 |