2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Event name
2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)
Start date
13-09-2021
End date
16-09-2021
Location
Gothenburg, Sweden
Country
Event format Veranstaltungsformat
Online
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Goekdeniz, Zeynep ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann | Temperature Dependent Relaxation Behavior of Ag-Sintered Copper Joints | Konferenzbeitrag Inproceedings | 2021 |