1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017) co-located with ISSTA 2017
Event name
1st ACM SIGSOFT International Workshop on Testing Embedded and Cyber-Physical Systems (TECPS 2017) co-located with ISSTA 2017
Start date
10-07-2017
End date
14-07-2017
Location
Santa Barbara, CA, USA
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.002 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Truong, Hong-Linh ; Berardinelli, Luca ; Yu, Tingting ; Marinov, Darko | Testing uncertainty of cyber-physical systems in IoT cloud infrastructures: combining model-driven engineering and elastic execution | Konferenzbeitrag Inproceedings  | 2017 |