14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Event name
14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Event type
Event for scientific audience
Start date
15-04-2013
End date
17-04-2013
Location
Wroclaw
Country
Solo Exhibition
Solo Exhibition
Event format Veranstaltungsformat
On Site
Results 1-3 of 3 (Search time: 0.002 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Kravchenko, Grygoriy ; Karunamurthy, Balamurugan ; Nelhiebel, Michael ; Pettermann, Heinz E. | Finite Element Analysis of Fatigue cracks Formation in Power Metallization of a Semiconductor Device Subjected to Active Cycling | Konferenzbeitrag Inproceedings | 2013 | |
| 2 | Köck, H. ; Filippis, Stefano de ; Nelhiebel, Michael ; Glavanovics, Michael ; Kaltenbacher, Manfred | Multiscale FE Modeling Concepts applied to Microelectronic Device Simulations | Präsentation Presentation | 2013 | |
| 3 | Eiser, Sebastian ; Kaltenbacher, Manfred ; Nelhiebel, Michael | Non-conforming Meshes in Multi-scale Thermo-mechanical Finite Element Analysis of Semiconductor Power Devices | Präsentation Presentation | 2013 |