17th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Event name
17th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)
Start date
17-04-2016
End date
20-04-2016
Location
Montpellier
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.001 seconds).
Preview | Authors / Editors | Title | Type | Issue Date | |
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1 | Springer, Martin ; Nelhiebel, Michael ; Pettermann, Heinz E. | Fatigue Crack Growth Modeling in the Metallization of Power Semiconductors under Cyclic Thermo-Mechanical Loading | Konferenzbeitrag Inproceedings | 2016 |