19 th Annual International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2018)
Event name
19 th Annual International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2018)
Start date
15-04-2018
End date
18-04-2018
Location
Toulouse, France
Country
Event format Veranstaltungsformat
On Site
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| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Springer, Martin ; Pettermann, Heinz E. ; Van Driel, Willem Dirk ; Rodgers, Peter ; Bailey, Christopher ; Vandevelde, Bart ; de Saint Leger, Olivier ; Zhang, G.Q. | A Thermo-Mechanical Fatigue Damage Modeling Methodology for Power Semiconductor Robustness Validation Studies | Konferenzbeitrag Inproceedings | 2018 |