20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Event name
20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems
Start date
24-03-2019
End date
27-03-2019
Location
Hannover
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.002 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Siroky, Georg ; Kraker, Elke ; Magnien, Julien ; Kozeschnik, Ernst ; Kieslinger, Dietmar ; Ecker, Werner | Numerical study on local effects of composition and geometry in self-healing solders | Konferenzbeitrag Inproceedings | 2019 |