International Conference of International Microelectronics and Packaging Society Poland Chapter

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Description

Event name
International Conference of International Microelectronics and Packaging Society Poland Chapter
 
Event type
Event for scientific audience
 
Start date
19-09-2005
End date
21-09-2005
 
Location
Koszalin-Darlowko, Poland
Country
Austria
 
Event format Veranstaltungsformat
On Site

Publications Publikationen


Treffer 1-3 von 3 (Suchzeit: 0.002 Sekunden).

VorschauAutor_in(nen)TitelDokumenttypErscheinungs­datum
1Gschohsmann, Walter ; Smetana, Walter FE-Analysis of Lead-Less Solder Joints with Pore InclusionKonferenzbeitrag Inproceedings2005
2Güleryüz, Deniz ; Smetana, Walter Mass Flow Sensor Realized in LTCC-TechnologyKonferenzbeitrag Inproceedings2005
3Smetana, Walter ; Gschohsmann, Walter Research Activities of the "Thick-film- and Ceramic-Microstructure-Packaging laboratory" at ISAS of Vienna University of TechnologyKonferenzbeitrag Inproceedings2005