International Conference of IMAPS Poland Chapter

Event name
International Conference of IMAPS Poland Chapter
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End date
Krakow, Polen
Event format Veranstaltungsformat
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PreviewAuthors / EditorsTitleTypeIssue Date
1Unger, Michael ; Smetana, Walter ; Radosavljevic, G. ; Zivanov, Ljiljana ; Nad, L. ; Maric, A. A Wireless Readout Temperature Sensor Realized in LTCC-TechnologyKonferenzbeitrag Inproceedings2008
2Radosavljevic, G. ; Marić, A. ; Stojanović, G. ; Zivanov, Lj. ; Smetana, Walter Application of the LTCC technology for the fabrication on miniature 3D RF transformersKonferenzbeitrag Inproceedings2007
3Smetana, Walter ; Gschohsmann, Walter Aspects of leaching and intermetallic growth by lead-free solderingKonferenzbeitrag Inproceedings2006
4Balluch, Bruno ; Lüftl, Sigrid ; Seidler, Sabine ; Smetana, Walter Binder Burnout Studies of LTCC Tapes by Means of Thermal AnalysesKonferenzbeitrag Inproceedings2008
5Smetana, Walter ; Walla, T. ; Unger, Michael Characterization of the thermal behaviour of flexible multilayer substrates for RFID applicationsKonferenzbeitrag Inproceedings2006
6Atassi, I. ; Smetana, Walter ; Edetsberger, M. ; Köhler, G. Design and Characterization of a Perfusion Module fabricated in LTCC Technology for Monitoring Biological CellsKonferenzbeitrag Inproceedings2008
7Balluch, Bruno ; Smetana, Walter ; Stangl, Günther Fine Structured Channel Arrays and Bridging Elements for LTCC-Technology ApplicationsKonferenzbeitrag Inproceedings2008
8Gschohsmann, Walter ; Smetana, Walter Interdependency of pores and mechanical stength of lead-free solder joints on Ag-thick film metallizationKonferenzbeitrag Inproceedings2006
9Gschohsmann, Walter ; Smetana, Walter Stress Distribution Analyses in Loaded Optical FibersKonferenzbeitrag Inproceedings2008
10Nagl, Bernhard ; Pietsch, Karl ; Gschohsmann, Walter ; Smetana, Walter Thermal performance of traction IGBT'sKonferenzbeitrag Inproceedings2008
11Bilinski, M ; Eisermann, E. ; Jones-Williams, K. ; Smetana, Walter ; Unger, Michael ; Withmarsh, J. Thick film pastes for the manufacture of low cost, insulated aluminium substrates for use as integrated heat sinks for high intensity LEDsKonferenzbeitrag Inproceedings2008