Design, Test, Integration and Packaging of MEMS/MOEMS Symposium (DTIP)
Event name
Design, Test, Integration and Packaging of MEMS/MOEMS Symposium (DTIP)
Start date
25-04-2007
End date
27-04-2007
Location
Stresa, Laggio Maggiore, Italy
Country
Event format Veranstaltungsformat
On Site
Results 1-1 of 1 (Search time: 0.001 seconds).
| Preview | Authors / Editors | Title | Type | Issue Date | |
|---|---|---|---|---|---|
| 1 | Smetana, Walter ; Unger, Michael | Set-up and characterization of a humidity sensor realized in LTCC-technology | Konferenzbeitrag Inproceedings | 2007 |