34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference

Event name
34th International Microelectronics and Packaging IMAPS-CPMT Poland Conference
 
Event type
Event for scientific audience
 
Start date
22-09-2010
End date
25-09-2010
 
Location
Wroclaw
Country
Poland
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

Results 1-6 of 6 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Weilguni, Michael ; Smetana, Walter ; Kausel, Wilfried Influence of Lamination Parameters on Mechanical Properties of LTCC tapesKonferenzbeitrag Inproceedings 2010
2Weilguni, Michael ; Smetana, Walter ; Kausel, Wilfried Influence of Lamination Parameters on Mechanical Properties of LTCC tapesKonferenzbeitrag Inproceedings 2010
3Gschohsmann, Walter ; Nicolics, Johann A model to specify the deformations in ceramic sensor strips subjected to surface displacements in the contact areaKonferenzbeitrag Inproceedings 2010
4Gschohsmann, Walter ; Nicolics, Johann A model to specify the deformations in ceramic sensor strips subjected to surface displacements in the contact areaKonferenzbeitrag Inproceedings2010
5Schneider, Stefan ; Waismayer, Thomas ; Gschohsmann, Walter Thermal models of a power inverter modul considering the heat transfer due to forced air coolingKonferenzbeitrag Inproceedings 2010
6Schneider, Stefan ; Waismayer, Thomas ; Gschohsmann, Walter Thermal models of a power inverter modul considering the heat transfer due to forced air coolingKonferenzbeitrag Inproceedings2010