IMAPS Nordic 2017 Conf. on Microelectronics Packaging

Event name
IMAPS Nordic 2017 Conf. on Microelectronics Packaging
 
Event type
Event for scientific audience
 
Start date
01-05-2017
End date
03-05-2017
 
Location
Göteborg
Country
Sweden
 
Event format Veranstaltungsformat
On Site

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Silvano de Sousa, Jonathan ; Fulmek, Paul L. ; Unger, Michael ; Haumer, P. ; Nicolics, Johann Enhanced Heat Transport in Printed Circuit Boards via Passive Components EmbeddingKonferenzbeitrag Inproceedings 2017