JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS

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Journal description

Title Titel
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
 
e-ISSN
1573-482X
 
ISSN
0957-4522
 
Publisher Herausgeber
SPRINGER
 
Publisher's Address Herausgeber Adresse
VAN GODEWIJCKSTRAAT 30, DORDRECHT, NETHERLANDS, 3311 GZ
 
Listed in SCI Aufgelistet im SCI
 
Peer reviewed Begutachtet
 
 

Publications Publikationen

Results 1-14 of 14 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Suhir, E. ; Ghaffarian, R. ; Yi, S. ; Nicolics, J. Assessed interfacial strength and elastic moduli of the bonding material from shear-off test dataArtikel Article 2017
2Himmelbauer T - 2017 - Comments on Thermoelectric properties of rare earth...pdf.jpgHimmelbauer, Thomas ; Prokofiev, Andrey Comments on ‘‘Thermoelectric properties of rare earth containing type-I clathrate compound, Dy8Al16Si30’’Article Artikel Jan-2017
3Popok, V. N. ; Buhrkal-Donau, S. ; Czerny, B. ; Khatibi, G. ; Luo, H. ; Iannuzzo, F. ; Pedersen, K. B. Comparative study of wire bond degradation under power and mechanical accelerated testsArtikel Article 2019
4Suhir, Ephraim ; Ghaffarian, Reza ; Nicolics, Johann Could application of column-grid-array (CGA) technology result in inelastic-strain-free state-of-stress in solder material?Artikel Article2015
5Suhir, E. ; Ghaffarian, R. ; Nicolics, J. Could thermal stresses in a BGA/CGA-system be evaluated from a model intended for a homogeneously bonded assembly?Artikel Article 2016
6Suhir, Ephraim ; Ghaffarian, R. ; Nicolics, Johann Expected stress relief in a bi-material inhomogeneously bonded assembly with a low-modulus-and/or-low-fabrication-temperature bonding material at the endsArtikel Article 2016
7Andrews, Aaron Maxwell ; Schramböck, Matthias ; Roch, Tomas ; Schrenk, Werner ; Gornik, Erich ; Strasser, Gottfried Independent control of InAs quantum dot density and size on AlₓGa₁₋ₓAs surfacesArtikel Article 2008
8Atif, M. ; Nadeem, M. ; Grössinger, R. ; Turtelli, R. Sato ; Kubel, F. Magnetic, dielectric and magnetoelectric properties in (1 - x)Pb(Zr0.52Ti0.48 )O3 + (x)CoFe2O4 compositesArtikel Article2015
9Ristić, Mira ; Kremenović, Aleksandar ; Reissner, Michael ; Petrović, Željka ; Musić, Svetozar Microstructural and magnetic properties of electrospun hematite/cuprospinel compositesArtikel Article 2020
10Suhir, E. ; Nicolics, J. Power Core (PC) Embedding a Plurality of IC Devices and Sandwiched Between Two Dissimilar Insulated Metal Substrates (IMS'): Predicted Thermal StressesArtikel Article 2016
11Suhir, E. ; Ghaffarian, R. ; Nicolics, J. Predicted stresses in ball-grid-array (BGA) and column-grid-array (CGA) interconnections in a mirror-like package designArtikel Article 2016
12Suhir, E. ; Yi, S. ; Nicolics, J. ; Khatibi, G. ; Lederer, M. Semiconductor film grown on a circular substrate: predictive modeling of lattice-misfit stressesArtikel Article 2016
13Boturchuk, Ievgen ; Walter, Thomas ; Julsgaard, Brian ; Khatibi, Golta ; Schwarz, Sabine ; Stöger-Pollach, Michael ; Pedersen, Kjeld ; Popok, Vladimir N. Structure and properties of Ta/Al/Ta and Ti/Al/Ti/Au multilayer metal stacks formed as ohmic contacts on n-GaNArtikel Article 2019
14Brincker, Mads ; Walter, Thomas ; Kristensen, Peter K. ; Popok, Vladimir N. Thermo-mechanically induced texture evolution and micro-structural change of aluminum metallizationArtikel Article 2017