Full name Familienname, Vorname
Kornfeind, N.
 

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PreviewAuthor(s)TitleTypeIssue Date
1Hell, J. ; Chirtoc, M. ; Eisenmenger-Sittner, C. ; Hutter, H. ; Kornfeind, N. ; Kijamnajsuk, P. ; Kitzmantel, M. ; Neubauer, E. ; Zellhofer, K. Characterisation of sputter deposited niobium and boron interlayer in the copper-diamond systemArtikel Article 2012
2Schäfer, D. ; Eisenmenger-Sittner, C. ; Chirtoc, Mihai ; Kijamnajsuk, P. ; Kornfeind, N. ; Hutter, H. ; Neubauer, E. ; Kitzmantel, M. Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayersArtikel Article 2011
3Schäfer, D. ; Hell, J. ; Eisenmenger-Sittner, C. ; Neubauer, E. ; Hutter, H. ; Kornfeind, N. Suppression of de-wetting of copper coatings on carbon substrates by metal (Cr, Mo, Ti) doped boron interlayersArtikel Article 2009