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| | Preview | Authors / Editors | Title | Type | Issue Date |
| 1 | | Khatibi, Golta ; Mazloum Nejadari, Ali ; Lederer, Martin ; Delshadmanesh, Mitra ; Czerny, Bernhard ; Hénaff, G. | Fatigue life time modelling of Cu and Au fine wires | Konferenzbeitrag Inproceedings | 2018 |
| 2 | | Mazloum Nejadari, Ali ; Khatibi, Golta ; Czerny, Bernhard ; Lederer, Martin ; Nicolics, Johann ; Weiss, Laurenz | Reliability of Cu wire bonds in microelectronic packages | Artikel Article | 2017 |
| 3 | | Mazloum Nejadari, Ali ; Lederer, Martin ; Khatibi, Golta ; Nicolics, Johann | Crystal plasticity modeling of the heat affected zone of copper micro-wires | Konferenzbeitrag Inproceedings | 2017 |
| 4 | | Czerny, Bernhard ; Mazloum Nejadari, Ali ; Khatibi, Golta | Reliability Analysis of fine and thick wire bonds | Präsentation Presentation | 2016 |
| 5 | | Czerny, Bernhard ; Mazloum Nejadari, Ali ; Khatibi, Golta ; Weiss, Laurenz ; Zehetbauer, Michael J. | Fatigue testing method for fine bond wires in an LQFP package | Artikel Article | 2016 |
| 6 | | Mazloum Nejadari, Ali ; Khatibi, Golta ; Lederer, Martin ; Czerny, Bernhard ; Nicolics, Johann ; Weiss, Laurenz | Reliability analysis of Cu wire bonds in microelectronic packages | Konferenzbeitrag Inproceedings | 2016 |
