Full name Familienname, Vorname
Croes, K.
 

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PreviewAuthor(s)TitleTypeIssue Date
1Saleh, A. S. ; Zahedmanesh, H. ; Ceric, H. ; Croes, K. ; De Wolf, I. Dynamics of Electromigration Voids in Cu Interconnects: Investigation Using a Physics-Based Model Augmented by Neural NetworksKonferenzbeitrag Inproceedings 2022
2Franco, J. ; Arimura, H. ; de Marneffe, J.-F. ; Vandooren, A. ; Ragnarsson, L.-A ; Wu, Z. ; Claes, D. ; Litta, E. Dentoni ; Horiguchi, N. ; Croes, K. ; Linten, D. ; Grasser, T. ; Kaczer, B. Novel low thermal budget gate stack solutions for BTI reliability in future Logic Device technologies : Invited paperKonferenzbeitrag Inproceedings2021
3Ceric, H. ; Selberherr, S. ; Zahedmanesh, H. ; de Orio, R. L. ; Croes, K. Review - Modeling Methods for Analysis of Electromigration Degradation in Nano-InterconnectsArtikel Article 2021
4Ceric, H. ; Zahedmanesh, H. ; Croes, K. Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsArtikel Article 2019