Prefix title Titel (vorangestellt)
Associate Prof. Dipl.-Ing. Dr.techn.
Full name Familienname, Vorname
Ceric, Hajdin
Main Affiliation Organisations­zuordnung

Results 1-20 of 162 (Search time: 0.003 seconds).

PreviewAuthors / EditorsTitleTypeIssue Date
1Ceric, H. ; de Orio, R.L. ; Selberherr, S. Microstructural Impact on Electromigration Reliability of Gold InterconnectsKonferenzbeitrag Inproceedings 2022
2Ceric, H. ; de Orio, R. L. ; Selberherr, S. Electromigration Degradation of Gold Interconnects: A Statistical StudyKonferenzbeitrag Inproceedings 2022
3Saleh, A. S. ; Zahedmanesh, H. ; Ceric, H. ; Croes, K. ; De Wolf, I. Dynamics of Electromigration Voids in Cu Interconnects: Investigation Using a Physics-Based Model Augmented by Neural NetworksKonferenzbeitrag Inproceedings 2022
4Ceric, Hajdin ; Orio, Roberto ; Selberherr, Siegfried Impact of Gold Interconnect Microstructure on Electromigration Failure Time StatisticsKonferenzbeitrag Inproceedings 2022
5Ceric, Hajdin ; Zahedmanesh, Houman ; Lacerda de Orio, Roberto ; Selberherr, Siegfried ; Yurish, Sergey Y. Models and Techniques for Reliability Studies of Nano-Scaled InterconnectsBuchbeitrag Book Contribution 2021
6Ceric, H. ; Selberherr, S. ; Zahedmanesh, H. ; de Orio, R. L. ; Croes, K. Review - Modeling Methods for Analysis of Electromigration Degradation in Nano-InterconnectsArtikel Article 2021
7Saleh, Ahmed ; Ceric, Hajdin ; Zahedmanesh, Houman Void-Dynamics in Nano-Wires and the Role of Microstructure Investigated via a Multi-Scale Physics-Based ModelArtikel Article 2021
8Ceric, Hajdin ; Zahedmanesh, Houman Advanced Modeling and Simulation of Cu Nano-Interconnects ReliabilityKonferenzbeitrag Inproceedings 2019
9Ceric, Hajdin ; Selberherr, Siegfried ; Zahedmanesh, Houman ; Orio, Roberto ; Croes, Kristof Assessment of Electromigration in Nano‐InterconnectsKonferenzbeitrag Inproceedings2019
10Grill, A. ; Stampfer, B. ; Im, Ki-Sik ; Lee, J.-H. ; Ostermaier, C. ; Ceric, H. ; Waltl, M. ; Grasser, T. Electrostatic Coupling and Identification of Single-Defects in GaN/AlGaN Fin-MIS-HEMTsArtikel Article2019
11Ceric, Hajdin ; Zahedmanesh, Houman ; Croes, Kristof Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsPräsentation Presentation2019
12Ceric, H. ; Zahedmanesh, H. ; Croes, K. Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsArtikel Article2019
13Grill, A. ; Stampfer, B. ; Waltl, M. ; Im, Ki-Sik ; Lee, J.-H. ; Ostermaier, C. ; Ceric, H. ; Grasser, T. Characterization and modeling of single defects in GaN/AlGaN fin-MIS-HEMTsKonferenzbeitrag Inproceedings 2017
14Ceric, Hajdin ; Orio, Roberto ; Rovitto, Marco TCAD Approach for the Assessment of Interconnect ReliabilityKonferenzbeitrag Inproceedings2016
15Rovitto, Marco ; Ceric, Hajdin Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon ViasKonferenzbeitrag Inproceedings 2016
16Papaleo, Santo ; Rovitto, Marco ; Ceric, Hajdin Mechanical Effects of the Volmer-Weber Growth in the TSV SidewallKonferenzbeitrag Inproceedings 2016
17Papaleo, S. ; Ceric, H. A finite element method study of delamination at the interface of the TSV interconnectsKonferenzbeitrag Inproceedings2016
18Sharma, Prateek ; Tyaginov, Stanislav ; Jech, Markus ; Wimmer, Yannick ; Rudolf, Florian ; Enichlmair, Hubert ; Park, Jong-Mun ; Ceric, Hajdin ; Grasser, Tibor The Role of Cold Carriers and the Multiple-Carrier Process of Si-H Bond Dissociation for Hot-Carrier Degradation in n- and p-channel LDMOS DevicesArtikel Article2016
19Papaleo, Santo ; Zisser, Wolfhard H. ; Singulani, Anderson P. ; Ceric, Hajdin ; Selberherr, Siegfried Stress Evolution During Nanoindentation in Open TSVsArtikel Article2016
20Grill, A. ; Rzepa, G. ; Lagger, P. ; Ostermaier, C. ; Ceric, Hajdin ; Grasser, T. Charge feedback mechanisms at forward threshold voltage stress in GaN/AlGaN HEMTsKonferenzbeitrag Inproceedings 2015

Results 1-3 of 3 (Search time: 0.003 seconds).