Ceric, Hajdin

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Prefix title Titel (vorangestellt)
Associate Prof. Dipl.-Ing. Dr.techn.
 
Full name Familienname, Vorname
Ceric, Hajdin
 
Main Affiliation Organisations­zuordnung
 

Own Publications Eigene Publikationen

Results 1-20 of 162 (Search time: 0.003 seconds).

PreviewAuthors / EditorsTitleTypeIssue Date
1Ceric, H. ; de Orio, R.L. ; Selberherr, S. Microstructural Impact on Electromigration Reliability of Gold InterconnectsKonferenzbeitrag Inproceedings 2022
2Ceric, H. ; de Orio, R. L. ; Selberherr, S. Electromigration Degradation of Gold Interconnects: A Statistical StudyKonferenzbeitrag Inproceedings 2022
3Saleh, A. S. ; Zahedmanesh, H. ; Ceric, H. ; Croes, K. ; De Wolf, I. Dynamics of Electromigration Voids in Cu Interconnects: Investigation Using a Physics-Based Model Augmented by Neural NetworksKonferenzbeitrag Inproceedings 2022
4Ceric, Hajdin ; Orio, Roberto ; Selberherr, Siegfried Impact of Gold Interconnect Microstructure on Electromigration Failure Time StatisticsKonferenzbeitrag Inproceedings 2022
5Ceric, Hajdin ; Zahedmanesh, Houman ; Lacerda de Orio, Roberto ; Selberherr, Siegfried ; Yurish, Sergey Y. Models and Techniques for Reliability Studies of Nano-Scaled InterconnectsBuchbeitrag Book Contribution 2021
6Ceric, H. ; Selberherr, S. ; Zahedmanesh, H. ; de Orio, R. L. ; Croes, K. Review - Modeling Methods for Analysis of Electromigration Degradation in Nano-InterconnectsArtikel Article 2021
7Saleh, Ahmed ; Ceric, Hajdin ; Zahedmanesh, Houman Void-Dynamics in Nano-Wires and the Role of Microstructure Investigated via a Multi-Scale Physics-Based ModelArtikel Article 2021
8Ceric, Hajdin ; Zahedmanesh, Houman Advanced Modeling and Simulation of Cu Nano-Interconnects ReliabilityKonferenzbeitrag Inproceedings 2019
9Ceric, Hajdin ; Selberherr, Siegfried ; Zahedmanesh, Houman ; Orio, Roberto ; Croes, Kristof Assessment of Electromigration in Nano‐InterconnectsKonferenzbeitrag Inproceedings2019
10Grill, A. ; Stampfer, B. ; Im, Ki-Sik ; Lee, J.-H. ; Ostermaier, C. ; Ceric, H. ; Waltl, M. ; Grasser, T. Electrostatic Coupling and Identification of Single-Defects in GaN/AlGaN Fin-MIS-HEMTsArtikel Article2019
11Ceric, Hajdin ; Zahedmanesh, Houman ; Croes, Kristof Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsPräsentation Presentation2019
12Ceric, H. ; Zahedmanesh, H. ; Croes, K. Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsArtikel Article2019
13Grill, A. ; Stampfer, B. ; Waltl, M. ; Im, Ki-Sik ; Lee, J.-H. ; Ostermaier, C. ; Ceric, H. ; Grasser, T. Characterization and modeling of single defects in GaN/AlGaN fin-MIS-HEMTsKonferenzbeitrag Inproceedings 2017
14Ceric, Hajdin ; Orio, Roberto ; Rovitto, Marco TCAD Approach for the Assessment of Interconnect ReliabilityKonferenzbeitrag Inproceedings2016
15Rovitto, Marco ; Ceric, Hajdin Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon ViasKonferenzbeitrag Inproceedings 2016
16Papaleo, Santo ; Rovitto, Marco ; Ceric, Hajdin Mechanical Effects of the Volmer-Weber Growth in the TSV SidewallKonferenzbeitrag Inproceedings 2016
17Papaleo, S. ; Ceric, H. A finite element method study of delamination at the interface of the TSV interconnectsKonferenzbeitrag Inproceedings2016
18Sharma, Prateek ; Tyaginov, Stanislav ; Jech, Markus ; Wimmer, Yannick ; Rudolf, Florian ; Enichlmair, Hubert ; Park, Jong-Mun ; Ceric, Hajdin ; Grasser, Tibor The Role of Cold Carriers and the Multiple-Carrier Process of Si-H Bond Dissociation for Hot-Carrier Degradation in n- and p-channel LDMOS DevicesArtikel Article2016
19Papaleo, Santo ; Zisser, Wolfhard H. ; Singulani, Anderson P. ; Ceric, Hajdin ; Selberherr, Siegfried Stress Evolution During Nanoindentation in Open TSVsArtikel Article2016
20Grill, A. ; Rzepa, G. ; Lagger, P. ; Ostermaier, C. ; Ceric, Hajdin ; Grasser, T. Charge feedback mechanisms at forward threshold voltage stress in GaN/AlGaN HEMTsKonferenzbeitrag Inproceedings 2015

Contributing Publications Mitbeteiligte Publikationen

Results 1-3 of 3 (Search time: 0.003 seconds).

PreviewAuthors / EditorsTitleTypeIssue Date
1Zisser Wolfhard H - 2016 - Electromigration in interconnect structures.pdf.jpgZisser, Wolfhard H. Electromigration in interconnect structuresThesis Hochschulschrift 2016
2Pires Singulani Anderson - 2014 - Advanced methods for mechanical analysis and...pdf.jpgPires Singulani, Anderson Advanced methods for mechanical analysis and simulation of through silicon viasThesis Hochschulschrift 2014
3Zisser, Wolfhard H. Untersuchung an Kupferkristallen unter Zuhilfenahme von MD SimulationenThesis Hochschulschrift2011