Name Card

Full name Familienname, Vorname
Ceric, Hajdin
 
Main Affiliation Organisations­zuordnung
 

Own Publications Eigene Publikationen

Results 1-20 of 168 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Ceric, Hajdin ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Statistical Study of Electromigration in Gold InterconnectsArticle Artikel Aug-2023
2Ceric, Hajdin ; Zahedmanesh, Houman ; Croes, Kristof ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Electromigration-Induced Void Evolution and Failure of Cu/SiCN Hybrid BondsArticle Artikel 14-Mar-2023
3Ceric, Hajdin ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Microstructural impact on electromigration reliability of gold interconnectsArticle Artikel Feb-2023
4Saleh, Ahmed S. ; Zahedmanesh, Houman ; Ceric, Hajdin ; De Wolf, Ingrid ; Croes, Kristof Impact of via geometry and line extension on via-electromigration in nano-interconnectsInproceedings Konferenzbeitrag2023
5Ceric, Hajdin ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Statistical Study of Electromigration in Gold InterconnectsInproceedings Konferenzbeitrag 31-Oct-2022
6Ceric, Hajdin ; Orio, Roberto ; Selberherr, Siegfried Impact of Gold Interconnect Microstructure on Electromigration Failure Time StatisticsKonferenzbeitrag Inproceedings 2022
7Ceric, H. ; de Orio, R.L. ; Selberherr, S. Microstructural Impact on Electromigration Reliability of Gold InterconnectsKonferenzbeitrag Inproceedings 2022
8Ceric, H. ; de Orio, R. L. ; Selberherr, S. Electromigration Degradation of Gold Interconnects: A Statistical StudyKonferenzbeitrag Inproceedings 2022
9Saleh, A. S. ; Zahedmanesh, H. ; Ceric, H. ; Croes, K. ; De Wolf, I. Dynamics of Electromigration Voids in Cu Interconnects: Investigation Using a Physics-Based Model Augmented by Neural NetworksKonferenzbeitrag Inproceedings 2022
10Ceric, H. ; Selberherr, S. ; Zahedmanesh, H. ; de Orio, R. L. ; Croes, K. Review - Modeling Methods for Analysis of Electromigration Degradation in Nano-InterconnectsArtikel Article 2021
11Saleh, Ahmed ; Ceric, Hajdin ; Zahedmanesh, Houman Void-Dynamics in Nano-Wires and the Role of Microstructure Investigated via a Multi-Scale Physics-Based ModelArtikel Article 2021
12Ceric, Hajdin ; Zahedmanesh, Houman ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Models and Techniques for Reliability Studies of Nano-Scaled InterconnectsBuchbeitrag Book Contribution 2021
13Ceric, Hajdin ; Selberherr, Siegfried ; Zahedmanesh, Houman ; Orio, Roberto ; Croes, Kristof Assessment of Electromigration in Nano‐InterconnectsKonferenzbeitrag Inproceedings2019
14Ceric, Hajdin ; Zahedmanesh, Houman Advanced Modeling and Simulation of Cu Nano-Interconnects ReliabilityKonferenzbeitrag Inproceedings 2019
15Ceric, Hajdin ; Zahedmanesh, Houman ; Croes, Kristof Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsPräsentation Presentation2019
16Ceric, H. ; Zahedmanesh, H. ; Croes, K. Analysis of Electromigration Failure of Nano-Interconnects through a Combination of Modeling and Experimental MethodsArtikel Article 2019
17Grill, A. ; Stampfer, B. ; Im, Ki-Sik ; Lee, J.-H. ; Ostermaier, C. ; Ceric, H. ; Waltl, M. ; Grasser, T. Electrostatic Coupling and Identification of Single-Defects in GaN/AlGaN Fin-MIS-HEMTsArtikel Article 2019
18Grill, A. ; Stampfer, B. ; Waltl, M. ; Im, Ki-Sik ; Lee, J.-H. ; Ostermaier, C. ; Ceric, H. ; Grasser, T. Characterization and modeling of single defects in GaN/AlGaN fin-MIS-HEMTsKonferenzbeitrag Inproceedings 2017
19Papaleo, Santo ; Rovitto, Marco ; Ceric, Hajdin Mechanical Effects of the Volmer-Weber Growth in the TSV SidewallKonferenzbeitrag Inproceedings 2016
20Rovitto, Marco ; Ceric, Hajdin Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon ViasKonferenzbeitrag Inproceedings 2016

Contributing Publications Mitbeteiligte Publikationen

Results 1-5 of 5 (Search time: 0.002 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Zisser Wolfhard H - 2016 - Electromigration in interconnect structures.pdf.jpgZisser, Wolfhard H. Electromigration in interconnect structuresThesis Hochschulschrift 2016
2Papaleo Santo - 2016 - Mechanical Reliability of open through silicon via...pdf.jpgPapaleo, Santo Mechanical Reliability of open through silicon via structures for integrated circuitsThesis Hochschulschrift 2016
3Rovitto Marco - 2016 - Electromigration reliability issue in interconnects for...pdf.jpgRovitto, Marco Electromigration reliability issue in interconnects for three-dimensional integration technologiesThesis Hochschulschrift 2016
4Pires Singulani Anderson - 2014 - Advanced methods for mechanical analysis and...pdf.jpgPires Singulani, Anderson Advanced methods for mechanical analysis and simulation of through silicon viasThesis Hochschulschrift 2014
5Zisser, Wolfhard H. Untersuchung an Kupferkristallen unter Zuhilfenahme von MD SimulationenThesis Hochschulschrift2011