Record link: 
http://hdl.handle.net/20.500.12708/187444
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Title: 
Statistical Study of Electromigration in Gold Interconnects
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Citation: 
Ceric, H., Lacerda de Orio, R., & Selberherr, S. (2022). Statistical Study of Electromigration in Gold Interconnects. In 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (pp. 1–5). IEEE. https://doi.org/10.1109/IPFA55383.2022.9915762
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Publisher DOI: 
10.1109/IPFA55383.2022.9915762
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Ceric, Hajdin 
Lacerda de Orio, Roberto 
Selberherr, Siegfried 
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Organisational Unit: 
E360 - Institut für Mikroelektronik 
E360-01 - Forschungsbereich Mikroelektronik 
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Published in: 
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 
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ISBN: 
978-1-6654-9815-9
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DOI of the book: 
10.1109/IPFA55383.2022
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Date (published): 
31-Oct-2022
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Event name: 
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 
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Event date: 
18-Jul-2022 - 21-Jul-2022
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Event place: 
Singapore, Singapore
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Number of Pages: 
5
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Publisher: 
IEEE
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Peer reviewed: 
Yes
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Keywords: 
gold interconnects; modeling; simulation; electromigration; scaling effects
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Research Areas: 
Metallic Materials: 20%
Modeling and Simulation: 50%
Computational Materials Science: 30%
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Science Branch: 
2020 - Elektrotechnik, Elektronik, Informationstechnik: 100%
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Appears in Collections:
Conference Paper

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