2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Book title Buchtitel
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
 
ISBN
978-1-6654-9815-9
 
Publisher Herausgeber
IEEE
 
DOI
10.1109/IPFA55383.2022
 

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Ceric, Hajdin ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Statistical Study of Electromigration in Gold InterconnectsInproceedings Konferenzbeitrag 31-Oct-2022