2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Event name
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
 
Event type
Event for scientific audience
 
Start date
18-07-2022
End date
21-07-2022
 
Location
Singapore
Country
Singapore
 
Event format Veranstaltungsformat
Hybrid

Publications Publikationen

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PreviewAuthor(s)TitleTypeIssue Date
1Ceric, Hajdin ; Lacerda de Orio, Roberto ; Selberherr, Siegfried Statistical Study of Electromigration in Gold InterconnectsInproceedings Konferenzbeitrag 31-Oct-2022