<div class="csl-bib-body">
<div class="csl-entry">Ceric, H., Lacerda de Orio, R., & Selberherr, S. (2022). Statistical Study of Electromigration in Gold Interconnects. In <i>2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)</i> (pp. 1–5). IEEE. https://doi.org/10.1109/IPFA55383.2022.9915762</div>
</div>
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dc.identifier.uri
http://hdl.handle.net/20.500.12708/187444
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dc.language.iso
en
-
dc.subject
gold interconnects
en
dc.subject
modeling
en
dc.subject
simulation
en
dc.subject
electromigration
en
dc.subject
scaling effects
en
dc.title
Statistical Study of Electromigration in Gold Interconnects
en
dc.type
Inproceedings
en
dc.type
Konferenzbeitrag
de
dc.relation.isbn
978-1-6654-9815-9
-
dc.relation.doi
10.1109/IPFA55383.2022
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dc.description.startpage
1
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dc.description.endpage
5
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dc.type.category
Full-Paper Contribution
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tuw.booktitle
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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tuw.peerreviewed
true
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tuw.relation.publisher
IEEE
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tuw.researchTopic.id
M3
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tuw.researchTopic.id
C6
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tuw.researchTopic.id
C1
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tuw.researchTopic.name
Metallic Materials
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tuw.researchTopic.name
Modeling and Simulation
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tuw.researchTopic.name
Computational Materials Science
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tuw.researchTopic.value
20
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tuw.researchTopic.value
50
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tuw.researchTopic.value
30
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tuw.publication.orgunit
E360 - Institut für Mikroelektronik
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tuw.publication.orgunit
E360-01 - Forschungsbereich Mikroelektronik
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tuw.publisher.doi
10.1109/IPFA55383.2022.9915762
-
dc.description.numberOfPages
5
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tuw.author.orcid
0000-0002-5583-6177
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tuw.event.name
2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
en
tuw.event.startdate
18-07-2022
-
tuw.event.enddate
21-07-2022
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tuw.event.online
Hybrid
-
tuw.event.type
Event for scientific audience
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tuw.event.place
Singapore
-
tuw.event.country
SG
-
tuw.event.presenter
Ceric, Hajdin
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wb.sciencebranch
Elektrotechnik, Elektronik, Informationstechnik
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wb.sciencebranch.oefos
2020
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wb.sciencebranch.value
100
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item.languageiso639-1
en
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item.openairetype
conference paper
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none
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item.fulltext
no Fulltext
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item.cerifentitytype
Publications
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item.openairecristype
http://purl.org/coar/resource_type/c_5794
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crisitem.author.dept
E360-01 - Forschungsbereich Mikroelektronik
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crisitem.author.dept
E360-01 - Forschungsbereich Mikroelektronik
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crisitem.author.dept
E360 - Institut für Mikroelektronik
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crisitem.author.orcid
0000-0002-5583-6177
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crisitem.author.parentorg
E360 - Institut für Mikroelektronik
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crisitem.author.parentorg
E360 - Institut für Mikroelektronik
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crisitem.author.parentorg
E350 - Fakultät für Elektrotechnik und Informationstechnik
