Record link: 
http://hdl.handle.net/20.500.12708/153576
-
Title: 
Microstructural Impact on Electromigration Reliability of Gold Interconnects
en
Citation: 
Ceric, H., de Orio, R. L., & Selberherr, S. (2022). Microstructural Impact on Electromigration Reliability of Gold Interconnects. In SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet (pp. 178–179). http://hdl.handle.net/20.500.12708/153576
-
Publication Type: 
Inproceedings - Abstract Book Contribution
en
Language: 
English
-
Authors: 
Ceric, H. 
de Orio, R.L. 
Selberherr, S. 
-
Organisational Unit: 
E360 - Institut für Mikroelektronik 
-
Published in: 
SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet 
-
Date (published): 
2022
-
Event name: 
2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) 
-
Event date: 
6-Sep-2022 - 8-Sep-2022
-
Event place: 
Granada, Spain
-
Number of Pages: 
2
-
Peer reviewed: 
Yes
-
Keywords: 
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry
-
Research Areas: 
Modelling and Simulation: 100%
-
Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
-
Appears in Collections:
Conference Paper

Show full item record

Page view(s)

63
checked on Dec 1, 2023

Google ScholarTM

Check