2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022)

Event name
2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022)
 
Event type
Event for scientific audience
 
Start date
06-09-2022
End date
08-09-2022
 
Location
Granada
Country
Spain
 
Conference Track
Multi Track
Event format Veranstaltungsformat
On Site

Publications Publikationen

Results 1-9 of 9 (Search time: 0.006 seconds).

PreviewAuthor(s)TitleTypeIssue Date
1Rodrigues, Francio ; Aguinsky, Luiz Felipe ; Hössinger, Andreas ; Weinbub, Josef 3D Feature-Scale Modeling of Highly Selective Fluorocarbon Plasma EtchingKonferenzbeitrag Inproceedings 2022
2Selberherr, Siegfried ; Sverdlov, Viktor About Electron Transport and Spin Control in Semiconductor DevicesKonferenzbeitrag Inproceedings2022
3Lenz, Christoph ; Manstetten, Paul ; Hössinger, Andreas ; Weinbub, Josef Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD SimulationsKonferenzbeitrag Inproceedings 2022
4Milardovich, Diego ; Waldhoer, Dominic ; Jech, Markus ; El-Sayed, Al-Moatasem Bellah ; Grasser, Tibor Building Robust Machine Learning Force Fields by Composite Gaussian Approximation PotentialsKonferenzbeitrag Inproceedings 2022
5Fiorentini, Simone ; Ender, Johannes ; Orio, Roberto ; Selberherr, Siegfried ; Goes, Wolfgang ; Sverdlov, Viktor Comprehensive Evaluation of Torques in Ultra Scaled MRAM DevicesKonferenzbeitrag Inproceedings 2022
6Filipovic, Lado ; Baumgartner, Oskar ; Piso, Julius ; Bobinac, Josip ; Reiter, Tobias ; Strof, G ; Rzepa, Gerhard ; Stanojevic, Zlatan ; Karner, Markus DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7Konferenzbeitrag Inproceedings 2022
7Ceric, H. ; de Orio, R.L. ; Selberherr, S. Microstructural Impact on Electromigration Reliability of Gold InterconnectsKonferenzbeitrag Inproceedings 2022
8Aguinsky, Luiz Felipe ; Rodrigues, Francio ; Klemenschits, Xaver ; Filipovic, Lado ; Hössinger, Andreas ; Weinbub, Josef Modeling Non-Ideal Conformality during Atomic Layer Deposition in High Aspect Ratio StructuresKonferenzbeitrag Inproceedings 2022
9Hadámek, Tomás ; Goes, Wolfgang ; Selberherr, Siegfried ; Sverdlov, Viktor Modeling Thermal Effects in STT-MRAMKonferenzbeitrag Inproceedings 7-Sep-2022