Record link: 
http://hdl.handle.net/20.500.12708/153579
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Title: 
Modeling Thermal Effects in STT-MRAM
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Citation: 
Hadámek, T., Goes, W., Selberherr, S., & Sverdlov, V. (2022). Modeling Thermal Effects in STT-MRAM. In SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet (pp. 132–133). http://hdl.handle.net/20.500.12708/153579
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Publication Type: 
Inproceedings - Poster Contribution
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Language: 
English
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Authors: 
Hadámek, Tomás 
Goes, Wolfgang 
Selberherr, Siegfried 
Sverdlov, Viktor 
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Organisational Unit: 
E360-01 - Forschungsbereich Mikroelektronik 
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Published in: 
SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet 
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Date (published): 
7-Sep-2022
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Event name: 
2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) 
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Event date: 
6-Sep-2022 - 8-Sep-2022
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Event place: 
Granada, Spain
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Number of Pages: 
2
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Peer reviewed: 
Yes
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Keywords: 
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry
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Research Areas: 
Modelling and Simulation: 100%
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Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
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Appears in Collections:
Conference Paper

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