SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet

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SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet
 

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PreviewAuthor(s)TitleTypeIssue Date
1Rodrigues, Francio ; Aguinsky, Luiz Felipe ; Hössinger, Andreas ; Weinbub, Josef 3D Feature-Scale Modeling of Highly Selective Fluorocarbon Plasma EtchingKonferenzbeitrag Inproceedings 2022
2Selberherr, Siegfried ; Sverdlov, Viktor About Electron Transport and Spin Control in Semiconductor DevicesKonferenzbeitrag Inproceedings2022
3Lenz, Christoph ; Manstetten, Paul ; Hössinger, Andreas ; Weinbub, Josef Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD SimulationsKonferenzbeitrag Inproceedings 2022
4Milardovich, Diego ; Waldhoer, Dominic ; Jech, Markus ; El-Sayed, Al-Moatasem Bellah ; Grasser, Tibor Building Robust Machine Learning Force Fields by Composite Gaussian Approximation PotentialsKonferenzbeitrag Inproceedings 2022
5Fiorentini, Simone ; Ender, Johannes ; Orio, Roberto ; Selberherr, Siegfried ; Goes, Wolfgang ; Sverdlov, Viktor Comprehensive Evaluation of Torques in Ultra Scaled MRAM DevicesKonferenzbeitrag Inproceedings 2022
6Filipovic, Lado ; Baumgartner, Oskar ; Piso, Julius ; Bobinac, Josip ; Reiter, Tobias ; Strof, G ; Rzepa, Gerhard ; Stanojevic, Zlatan ; Karner, Markus DTCO Flow for Air Spacer Generation and its Impact on Power and Performance at N7Konferenzbeitrag Inproceedings 2022
7Ceric, H. ; de Orio, R.L. ; Selberherr, S. Microstructural Impact on Electromigration Reliability of Gold InterconnectsKonferenzbeitrag Inproceedings 2022
88Hadámek, Tomás ; Goes, Wolfgang ; Selberherr, Siegfried ; Sverdlov, Viktor Modeling Thermal Effects in STT-MRAMKonferenzbeitrag Inproceedings 7-Sep-2022