Record link: 
http://hdl.handle.net/20.500.12708/153580
-
Title: 
Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD Simulations
en
Citation: 
Lenz, C., Manstetten, P., Hössinger, A., & Weinbub, J. (2022). Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD Simulations. In SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet (pp. 117–118). http://hdl.handle.net/20.500.12708/153580
-
Publication Type: 
Inproceedings - Poster Contribution
en
Language: 
English
-
Authors: 
Lenz, Christoph 
Manstetten, Paul 
Hössinger, Andreas 
Weinbub, Josef 
-
Organisational Unit: 
E360 - Institut für Mikroelektronik 
-
Published in: 
SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet 
-
Date (published): 
2022
-
Event name: 
2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) 
en
Event date: 
6-Sep-2022 - 8-Sep-2022
-
Event place: 
Granada, Spain
-
Number of Pages: 
2
-
Peer reviewed: 
Yes
-
Keywords: 
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry
en
Link (external): 
https://congresos.ugr.es/sispad2022/
-
Research Areas: 
Modelling and Simulation: 100%
-
Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
-
Appears in Collections:
Conference Paper

Show full item record

Items in reposiTUm are protected by copyright, with all rights reserved, unless otherwise indicated.

Page view(s)

45
checked on Oct 17, 2023

Download(s)

2
checked on Oct 17, 2023

Google ScholarTM

Check