Record link: 
http://hdl.handle.net/20.500.12708/153580
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Title: 
Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD Simulations
en
Citation: 
Lenz, C., Manstetten, P., Hössinger, A., & Weinbub, J. (2022). Automatic Grid Refinement for Thin Material Layer Etching in Process TCAD Simulations. In SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet (pp. 117–118). http://hdl.handle.net/20.500.12708/153580
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Publication Type: 
Inproceedings - Poster Contribution
en
Language: 
English
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Authors: 
Lenz, Christoph 
Manstetten, Paul 
Hössinger, Andreas 
Weinbub, Josef 
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Organisational Unit: 
E360 - Institut für Mikroelektronik 
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Published in: 
SISPAD 2022: International Conference on Simulation of Semiconductor Processes and Devices - Conference Abstract Booklet 
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Date (published): 
2022
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Event name: 
2022 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2022) 
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Event date: 
6-Sep-2022 - 8-Sep-2022
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Event place: 
Granada, Spain
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Number of Pages: 
2
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Peer reviewed: 
Yes
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Keywords: 
Electrical and Electronic Engineering; Condensed Matter Physics; Electronic, Optical and Magnetic Materials; Materials Chemistry
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Link (external): 
https://congresos.ugr.es/sispad2022/
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Research Areas: 
Modelling and Simulation: 100%
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Science Branch: 
Elektrotechnik, Elektronik, Informationstechnik
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Appears in Collections:
Conference Paper

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