Record link: 
http://hdl.handle.net/20.500.12708/190049
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Title: 
Impact of via geometry and line extension on via-electromigration in nano-interconnects
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Citation: 
Saleh, A. S., Zahedmanesh, H., Ceric, H., De Wolf, I., & Croes, K. (2023). Impact of via geometry and line extension on via-electromigration in nano-interconnects. In 2023 IEEE International Reliability Physics Symposium (IRPS) Proceedings. 2023 IEEE International Reliability Physics Symposium (IRPS), Monterey, United States of America (the). https://doi.org/10.1109/IRPS48203.2023.10118027
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Publisher DOI: 
10.1109/IRPS48203.2023.10118027
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Publication Type: 
Inproceedings - Full-Paper Contribution
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Language: 
English
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Authors: 
Saleh, Ahmed S. 
Zahedmanesh, Houman 
Ceric, Hajdin 
De Wolf, Ingrid 
Croes, Kristof 
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Organisational Unit: 
E360 - Institut für Mikroelektronik 
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Published in: 
2023 IEEE International Reliability Physics Symposium (IRPS) Proceedings 
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ISBN: 
978-1-6654-5672-2
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DOI of the book: 
10.1109/IRPS48203.2023
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Date (published): 
2023
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Event name: 
2023 IEEE International Reliability Physics Symposium (IRPS) 
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Event date: 
26-Mar-2023 - 30-Mar-2023
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Event place: 
Monterey, United States of America (the)
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Number of Pages: 
4
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Keywords: 
electromigration; void dynamics; nanointerconnect; line extension; via taper angle
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Abstract: 
Via topology and line extension length can impact current crowding, stress distribution and void dynamics in the cathode region of nano-interconnects and therefore have an impact on electromigration lifetimes. In this study, a 2D physics-based model is employed to capture the effect of line extension and via taper angle on stress evolution and void dynamics, quantitatively. Varying via taper angle is shown to have higher impact on peak stress reduction (~0.8 MPa/nm of extra space) compared to line extension (~0.08 MPa/nm of extra space).
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Research Areas: 
Metallic Materials: 20%
Nanoelectronics: 30%
Modeling and Simulation: 50%
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Science Branch: 
2020 - Elektrotechnik, Elektronik, Informationstechnik: 100%
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Appears in Collections:
Conference Paper

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